Reference Design Kit for the Storage Bridge Bay 2.0 Specification by AMD

At
the Storage Networking World conference, AMD announced
availability of the first Reference Design Kit (RDK) for the Storage
Bridge Bay (SBB) 2.0 Specification based on the AMD Athlon processor.

This RDK can simplify the design process and provide a standardized
platform powered by AMD’s unrivaled Direct Connect Architecture. AMD
expects to help storage vendors deliver low power, high performance,
entry-level networked storage systems while helping reduce
time-to-market, allowing them to focus more on specific innovations
that their customers require. AMD also today announced an expansion of
its embedded product offerings with three new, low power AMD Athlon X2
Dual-Core processors for embedded system designs.

“AMD is focused on enhancing opportunities for innovation among
partners and customers by promoting open industry standards. This SBB
RDK could help our customers reduce the typical design cycle by three
to nine months,” said Buddy Broeker, director of Embedded Computing
Solutions, AMD. “Further, the new low power additions to our embedded
line-up provide system designers simplicity and flexibility to create
innovative, high-performing embedded systems powered by the exceptional
performance-per-watt and energy-efficiency of AMD processor
technology.”

AMD’s new SBB RDK provides storage vendors with a highly
configurable platform with the exceptional data throughput capabilities
of AMD Athlon and AMD Athlon X2 Dual-Core processors featuring Direct
Connect Architecture and HyperTransport technology. It allows them to
differentiate their systems based on customer needs while addressing
the need for high memory and I/O bandwidth in networked storage
environments. The RDK supports Network Attached Storage (NAS), Storage
Area Networks (SANs), Unified Storage systems, as well as all major
interface connectivity options including GigE, 10GigE, Fibre Channel,
and Infiniband. The RDK includes schematics and layout source files,
with reference design hardware to be available from AMD partner Newisys
Data Storage.

“Newisys Data Storage is extending our long collaboration with AMD
to help grow the ecosystem of standardized storage building blocks
which enable customers of all sizes the opportunity to deploy advanced
storage capabilities,” said Steve VonderHaar, vice president of product
marketing and business development for Newisys Data Storage. “The SBB
initiative is an integral component in our product roadmap, and we look
forward to launching more SBB-compliant OEM and joint development
designs later this year.”

“The reduced design costs and complexity delivered by SBB 2.0
combined with enhanced manageability, security, and reliability of
Windows Storage Servers will help promote affordable enterprise class
storage functionality to customers of all sizes,” said Bala
Kasiviswanathan, director of the Storage Solutions marketing division
at Microsoft. “Microsoft is pleased to collaborate with AMD in
delivering the promise of SBB 2.0 to our joint partners so they can
innovate on our platform and build solutions that better meet the needs
of our customers.”

In addition to Microsoft, AMD has also worked with storage software
companies AMI and FalconStor. These additional software developments on
the AMD SBB 2.0 RDK will provide customers several different
implementation options.

Expanding Low Power AMD Embedded Solutions Portfolio

AMD also announced the addition of three new low power AMD Athlon
X2 Dual-Core processors to its embedded product roadmap. These will
enhance the available options for deploying industry-changing AMD
technology in embedded systems that span from entry-level networked
storage systems designed with the new RDK, to other high-performance
embedded designs including telecommunications solutions, digital
signage, and point of sale, gaming, and kiosk systems. The new AMD
Athlon X2 Dual-Core processor Models 3400e, 3600+ and 4200+ deliver
greater levels of performance in the same low-power envelopes of 22,
35, and 35W maximum thermal design power, respectively.

Offering continued platform stability, the new additions are AM2
socket-compatible to help embedded system designers easily upgrade from
single-core or use their existing AM2 board designs to address new
markets with reduced time-to-market and development costs.

The new processors are designed to be paired with the AMD M690E
chip set, offering embedded customers a ready-to-implement, stable and
reliable commercial embedded platform. They can also be combined with
other industry-leading chipsets including the Broadcom HT-2100 and
HT-1000 chip sets for performance-hungry yet energy-efficient designs.
Availability is expected in the second quarter of 2008 with embedded
industry-standard component longevity of 5 years.

Advanced Micro Devices