Alliance Memory Introduces Six 8, 16, and 32Gb CMOS DDR4 SDRAMs in 78-Ball and 96-Ball FBGA Packages
Devices combine low 1.2V power consumption with fast clock speeds of 1,600MHz and transfer rates of 3,200MT/s.
This is a Press Release edited by StorageNewsletter.com on November 15, 2024 at 2:01 pmAlliance Memory, Inc. has expanded its portfolio of CMOS DDR4 SDRAMs with 6 new 8, 16, and 32Gb devices in 78-ball FBGA and 96-ball FBGA packages.
Providing the company’s customers with higher-density options for a range of applications, the AS4C512M16D4B-62BCN, AS4C1G8D4B-62BCN, AS4C1G16D4A-62BCN, AS4C2G8D4A-62BCN, AS4C2G16D4-62BCN, and AS4C4G8D4-62BCN are built on a new process technology to deliver improved performance – with lower power consumption and higher speeds and transfer rates – at a lower cost.
To increase battery life in portable electronics such as smartphones and tablets, the DDR4 SDRAMs released feature a low operating voltage of +1.2V (±0.06V). The devices are designed, qualified, and recommended for use in 5G and IoT designs; computing applications; surveillance, gaming, and networking storage systems; smart meters; human-machine interfaces (HMI), digital signal controllers, and PNDs; and more. Built on an 8n-prefetch architecture, the devices offer fast clock speeds of 1,600MHz and transfer rates of 3200 MT/s.
The AS4C512M16D4B-62BCN, AS4C1G8D4B-62BCN, AS4C1G16D4A-62BCN, AS4C2G8D4A-62BCN, AS4C2G16D4-62BCN, and AS4C4G8D4-62BCN support sequential and interleave burst types with RW burst lengths of BC4, BL8, and on the fly. An auto pre-charge function provides a self-timed row pre-charge initiated at the end of the burst sequence. Easy-to-use refresh functions include auto- or self-refresh.
With minimal die shrinks, the DDR4 SDRAMs provide reliable drop-in, pin-for-pin-compatible replacement for numerous similar solutions – eliminating the need for costly redesigns and part requalification. Offered in the commercial (0°C to +95°C) temperature range, the devices are for the industrial, networking, telecommunications, gaming, and consumer markets.
Device specs table:
Part # |
Density |
Organization |
Package |
Speed |
Temp. range (°C) |
8Gb |
512M x 16 |
96-ball FBGA |
1,600MHz |
0 to +95 |
|
8Gb |
1Gb x 8 |
78-ball FBGA |
1,600MHz |
0 to +95 |
|
16Gb |
1Gb x 16 |
96-ball FBGA |
1,600MHz |
0 to +95 |
|
16Gb |
2Gb x 8 |
78-ball FBGA |
1,600MHz |
0 to +95 |
|
32Gb |
2Gb x 16 |
96-ball FBGA |
1,600MHz |
0 to +95 |
|
32Gb |
4Gb x 8 |
78-ball FBGA |
1,600MHz |
0 to +95 |
Samples and production quantities of the AS4C512M16D4B-62BCN, AS4C1G8D4B-62BCN, AS4C1G16D4A-62BCN, AS4C2G8D4A-62BCN, AS4C2G16D4-62BCN, and AS4C4G8D4-62BCN are available, with lead times of 4 weeks.