Avalanche Technology Compact Gen 3 MRAM Boot Solutions for Aerospace and Defense

Avalanche Technology announced the rollout of 2 additions to the aerospace and defense Gen 3 STT-MRAM product suite: 64 and 128Mb densities.

For space-targeted processors and FPGAs with modest configuration image requirements, these products offer improved reliability, size and power for booting vs traditional legacy flash-based methods.

Responding to a groundswell of industry demand, Gen 3 STT-MRAM is recognized as the superior replacement to flash memory, whose radiation susceptibility creates reliability risks and inordinate hardware and software complexity.

The company’s Gen 3 STT-MRAM products offer the suite’s optimized radiation resilience and high reliability. Additionally, these compact (10x10mm FBGA), low power (15mA active) low density devices are electrically pin-compatible with existing high density Gen 3 DQSPI devices, providing scalability of density from 64Mb to 8Gb with the same pinout.

Available in the Space Grade family and the recently introduced enhanced Space Grade-E family, the latest products will have pin-compatible platform support for varying mission requirements for density, qualification and screening. The firm will work with industry partners to ensure that extension of NASA PEMS and QML flows is supported, as with the remainder of the Gen 3 portfolio. Additionally, die-level options exist for multichip modules, enabling FPGA, SoC and ASIC designers an opportunity to boost SWaP and reliability. These devices and their development kits are available, orderable through regional distribution partners.

“As we continue to innovate with high-reliability rad-hard and rad-tolerant semiconductor solutions, we are always searching for new methods to improve SWaP and reliability for the Aerospace and Defense community,” said Patrice Parris, CTO, VORAGO Technologies. “By leveraging Avalanche’s idealized boot solutions, now available with a size and density profile that matches the needs of our rad-hard and rad-tolerant MCUs and MPUs, we can accomplish both goals for a highly optimized processing solution.”

“By further extending our portfolio of idealized boot solutions for space, we are answering the call for improved SWaP and reliability across the continuum of processor and FPGA types“, said Danny Sabour, VP, sales and marketing, Avalanche. “While maintaining pin compatible scalability and robust write protection schemes, we continue to enable software-defined hardware platforms and in situ multi-mission adaptability.”

Gen 3 Space Grade and Space Grade-E MRAM
Gen 3 Space Grade and Space Grade-E are offered as standard products in parallel with asynchronous SRAM-compatible timing and dual QSPI high speed serial interface in various pin compatible density options from 1 to 8Gb.

Designed for high-reliability with multibit error correction and 10^16 write cycle endurance, data is always non-volatile.

The devices come in small footprint packaging (RoHS-compliant and leaded) and extended operating temperature range (-40°C to 125°C) with JEDEC qualification. There are additional qualification screening and packaging options available through partners.