Flash Memory Summit: Frore Systems and Phison Demo PCIe Gen5 SSD at Full Performance with no Throttling

At Flash Memory Summit 2023, Frore Systems demonstrated AirJet integrated into one of the fastest consumer SSDs from Phison Electronics Corp. 

The demo showcases the Phison PS5026-E26 PCIe Gen5 SSD controller with I/O+ technology actively cooled with 2 AirJet Minis, creating a powerful device in its class with 14,175MB/s sustained sequential read performance and over 1,000MB/s PCMark 10 Storage Tests performance – a world first for a NAND-based M.2 SSD.

AirJet enables this in a slim, dustproof, form-factor that is half the size and weight of existing solutions and provides focused heat removal that is completely independent of the system level thermal solution.

AirJet Mini

AirJet cools with technology that meets the ever-increasing demands of today’s gamers and PC performance enthusiasts. In addition to enhanced performance for data intensive work loads like CAD and CAM, the E26 AirJet enabled system is for the latest computer games featuring DirectStorage, currently shipping in Forspoken and Portal: Prelude RTX with more to ship in 2023. Market leading games use DirectStorage to deliver lower load times, more graphic detail, and eliminate unnecessary load scenes used to mask data processing. However, these innovations in addition to performance, will create a lot more heat – which is exactly why Phison has collaborated with Frore Systems. AirJet’s compact size and unique cooling features enable faster, thinner, lighter, silent, and dustproof devices.

“Phison has been a great collaborator with Frore Systems, demonstrating how AirJet is revolutionizing the SSD industry,” said Dr. Seshu Madhavapeddy, founder and CEO, Frore. “Until AirJet, heat removal was the only aspect of modern-day technology that hadn’t changed in decades. Phison’s latest E26 system with AirJet delivers maximum sustained performance in a slim form factor without reliance on system level cooling, illustrating the major performance improvements AirJet is bringing to the entire SSD industry.”

Heat is the single biggest problem facing the electronics industry, and SSDs are no exception. Until now, gamers have been forced to use expensive liquid cooling systems, or rely on antiquated thermal solutions like noisy mechanical fans or bulky ineffective heat sinks to remove heat generated by the ever-increasing gaming workloads. These inadequate thermal approaches cause systems to rapidly overheat, forcing reduced performance, throttling after only a few seconds of operation, preventing gamers from getting the performance and gaming experience they pay for.

Phison has solved this for Gamers, integrating 2 AirJet Minis on the Gen5 SSD to usher in a new era with higher memory speeds and greater performance.

“Phison is ecstatic to be showcasing product performance milestones for the industry, our partners and customers because we are committed and dedicated to engineering next generation technologies through ecosystem excellence,” said Michael Wu, GM and president, Phison Technology Inc. (USA). “Leveraging AirJet, a truly groundbreaking innovation in thermal solutions, we are continuing our legacy of leaning into technology that can bring enhanced experiences to market.”  

Frore Systems launched AirJet Mini in December 2023 and has seen unprecedented demand for the small, highly effective active cooling chip. The AirJet Mini is 2.8mm thick, 27.5×41.5mm in size, and weighs 11 grams. It is a scalable solution, with additional heat removal achievable by simply adding more AirJet chips.  Each chip removes 5W of heat, and the integration of multiple chips means 2 chips can remove 10W, three chips 15W and so on. AirJet’s compact size and scalable nature means manufacturers can adopt the heat removal technology in a range of applications, enabling increased performance in faster, thinner, lighter, silent, and dustproof devices.

About Frore Systems:
It is the developer of thermal technology for electronic and consumer devices. Its active cooling chip, AirJet Mini, is integrated into devices to remove heat silently, resulting in major performance gains. It is headquartered in San Jose, CA with an office and manufacturing facility in Taiwan.