R&D: Physical Model and Characteristics of 3D NAND Memory Cell Metastability Issues under High Temperature Stress

2023 IEEE International Memory Workshop (IMW) has published an article written by Andrew Bicksler, Carmine Miccoli, and Srinath Venkatesan, Technology Development Micron Technology, Inc, Boise, Idaho, USA.

Abstract: “A new memory device behavior has been experimentally identified and investigated in 3D NAND devices. The experimental results show that the memory device characteristics pertaining to channel properties are degraded through high temperature stress and can be subsequentially annealed depending upon the Vt level of the cell. This newly identified NAND memory cell metastability issue is characterized and the mechanism is identified as an increase in polysilicon trap density from alternate bonding configurations within the channel film/interfaces post hydrogen passivation.“