CDGM Glass Assigned Two Patents

Glass composition
CDGM Glass Co., Ltd., Chengdu, China, has been assigned a patent (11,440,836) developed by Mao, Lulu, Sun, Wei, and Kuang, Bo, Chengdu, China, for a “glass composition“

The abstract of the patent published by the U.S. Patent and Trademark Office states: “A glass composition with high Young’s modulus and low density. The glass composition includes the following components by mole percentage: 52-70% of SiO.sub.2, 5-10% of B.sub.2O.sub.3, 5-15% of Al.sub.2O.sub.3, 8-20% of CaO and 5-18% of MgO. The glass composition uses common chemical raw materials. By reasonably designing the contents of each component, the glass composition has high Young’s modulus, low density, good heat resistance and chemical stability, relatively low high-temperature viscosity, and low raw material cost. The glass composition is easy to eliminate stripes and bubbles during manufacturing, and is suitable for hard disk substrate manufacturing other fields that need high Young’s modulus materials.”

The patent application was filed on April 10, 2019 (17/050,571).

Glass composition
CDGM Glass Co., Ltd., Chengdu, China, has been assigned a patent (11,440,835) developed by Mao, Lulu, Kuang, Bo, Li, Xiaochun, Sun, Wei, Liu, Zhenyu, and Hao, Liangzhen, Chengdu, China, for a “glass composition“

The abstract of the patent published by the U.S. Patent and Trademark Office states: “A glass composition with high Young’s modulus and specific modulus, wherein the glass composition includes the following components by weight percentage: 30-46% of SiO.sub.2, 0-6% of B.sub.2O.sub.3, 10-30% of Al.sub.2O.sub.3, 4-20% of CaO, 2-15% of MgO, and 13-32% of Y.sub.2O.sub.3. The glass composition uses common chemical raw materials. By reasonably arranging the contents of each component, the glass is good in heat resistance, chemical stability and press-molding devitrification resistance performance, low in high-temperature viscosity, convenient in bubble elimination, with specific modulus above 34 and Young’s modulus above 100 GPa, and is suitable for hard disk substrate manufacturing, semiconductor sealing and other fields.”

The patent application was filed on November 19, 2018 (16/759,766).