Marvell Asia Assigned Two Patents

Error recovery in NAND memory operations
Marvell Asia Pte, Ltd., Singapore, Singapore, has been assigned a patent (10,901,868) developed by Dennin, III, William W., Mission Viejo, CA, and Huang, Chengkuo, Los Altos, CA, for “systems and methods for error recovery in NAND memory operations.“

The abstract of the patent published by the U.S. Patent and Trademark Office states: ”Embodiments described herein provide a mechanism to use an on-chip buffer memory in conjunction with an off-chip buffer memory for interim NAND write data storage. Specifically, the program data flows through the on-chip buffer memory to the NAND memory, while simultaneously a copy of the NAND program data is buffered in one or more circular buffer structures within the off-chip buffer memory.”

The patent application was filed on October 2, 2018 (16/149,831).

Thermal compensation for laser in HAMR
Marvell Asia Pte, Ltd., Singapore, Singapore, has been assigned a patent (10,896,694) developed by Oberg, Mats, San Jose, CA, and Fang, Hao, Eden Prairie, MN, for a “thermal compensation for laser in heat assisted magnetic recording.“

The abstract of the patent published by the U.S. Patent and Trademark Office states: ”A storage medium controller has been designed to maintain thermal stability of a heat source based on a history of heat source active/inactive durations so that a variation in spot size generated by the heat source is reduced during Heat Assisted Magnetic Recording (HAMR). The storage medium controller modulates power to the heat source based on these active/inactive durations. While the heat source is inactive, the storage medium controller increases a thermal compensation value and after the heat source is activated, the storage medium controller drives the heat source according to a current parameter proportional to the thermal compensation value. As the heat source continues being active, the storage medium controller decreases the thermal compensation value and proportional current parameter so that thermal stability of the heat source is maintained.”

The patent application was filed on October 29, 2019 (16/667,480).