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Dialog Semiconductor Licenses Non-Volatile Resistive RAM Technology

To GlobalFoundries

Dialog Semiconductor PLC, a provider of battery and power management, Wi-Fi and Bluetooth low energy (BLE) and GlobalFoundries, Inc. have entered into an agreement in which Dialog licenses its Conductive Bridging RAM (CBRAM) technology to GlobalFoundries.

Dialog

The resistive ram (ReRAM)-based technology was pioneered by Adesto Technologies Corporation which was acquired by Dialog Semiconductor in 2020. GlobalFoundries will first offer CBRAM as an embedded, non-volatile memory (NVM) option on its 22FDX platform, with the plan to extend to other platforms.

Dialog’s proprietary and production CBRAM technology is a low power NVM solution designed to enable a range of applications from IoT and 5G connectivity to AI. Low power consumption, high R/W speeds, reduced manufacturing costs and tolerance for harsh environments make CBRAM suitable for consumer, medical, and select industrial and automotive applications. Furthermore, CBRAM technology enables embedded NVM for technology nodes required for products in these markets.

CBRAM is one of Adesto’s marquee memory technologies and a game-changing addition to Dialog’s portfolio. This new licensing partnership with GlobalFoundries speaks to just how quickly Dialog and Adesto have hit the ground running together,” said Mark Tyndall, SVP of corporate development and GM of the Industrial mixed signal business group, Dialog. “Looking ahead, I am very positive about our strong relationship with GlobalFoundries. This agreement not only enables a state-of-the-art technology for the industry, but it also creates the opportunity for Dialog to adopt CBRAM technology for its next gen of system on chips.

Our partnership with Dialog demonstrates GF’s commitment to intensify investment in areas where we can further differentiate and add value for our customers,” said Mike Hogan, SVP and GM of automotive, industrial and multi-market, GF. “Dialog’s ReRAM technology is a great addition to our family of eNVM solutions. This memory solution, coupled with our FDX platform, will enable our customers to push the envelope and deliver a new gen of secure IoT and edge-AI applications.

Overcoming the integration and reliability challenges often associated with ReRAM, CBRAM technology offers a reliable low-cost embedded memory while maintaining ReRAMs low voltage operation. This translates to lower energy write and read access as compared to standard embedded flash offerings.

CBRAM will be available in production for use by GF customers as an embedded NVM option on its 22FDX platform in 2022. Through IP customization, customers may modify the CBRAM cell to optimize their SoC designs, enhance security, or even adapt the cell for new applications. Additionally, CBRAM being a back-end-of-line technology enables relatively easy integration into other technology nodes.

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