Amfeltec Assigned Patent for Advanced PCIe Board Assembly

Amfeltec Corporation announced that the USPTO (United States Patent and Trademark Office) has presented the company with Patent #10,664,431, entitled Advanced PCIe Board Assembly.

The patent includes 29 claims and 4 drawings. This is the company’s second patent concerning advanced PCIe board assembly (the first is US Patent #9,996,495). Both patents’ methods are intended for placing large electronic components or SSD and wireless modules on a PCIe carrier board, improving traditional methods.

The uniqueness of the patented assembly is based on the location of the carrier board: it is placed in the middle of the area reserved for the PCIe slot, as defined by the spec for a one-slot-wide PCIe board. Such placement allows for 2-sided positioning of add-in modules (on the component and soldering sides of the board), thus allowing one to double the number of add-in modules without violating the PCIe spec.

Shifting the carrier board relative to the center line of the motherboard PCIe slot allows the upstream connection (from carrier board to the motherboard) to be done via exchangeable male PCIe adapters. This way, the carrier board can be inserted into a PCIe connector of any size without encountering limitations.

“Our popular Squid PCIe Carrier Board family is based on this patented Advanced PCIe Board Assembly“, says Michael Feldman, president and CTO. “Only because of this architecture were we able to bring to the market the fastest half-height (2U) SSD PCIe carrier board that holds up to four M.2 SSD modules, and the fastest full-size SSD PCIe carrier board, with the maximum storage capacity possible today (up to 96TB).“