FMS: Everspin Builds Ecosystem for 1Gb Spin-Transfer Torque MRAM

Everspin Technologies, Inc. announced several ecosystem partnerships for its 1Gb Spin-transfer Torque Magnetoresistive Random Access Memory (STT-MRAM) product.

With volume production of MRAM devices spanning 128Kb to 256Mb and the demand for its 1GB STT-MRAM density part just entering production, the company is extending in MRAM memory component manufacturing.

The STT-MRAM devices enable enterprise infrastructure and data center providers to increase the reliability and performance of systems where performance data persistence is critical by delivering protection against power loss without the use of supercapacitors or batteries. In addition, the larger density 1GB part offers more effective management of I/O streams, creating a level of latency determinism and allowing storage OEMs to improve QoS of their products. Similar benefits can also be achieved using the 1GB STT-MRAM device as a persistent data write buffer in storage and fabric accelerators, computational storage, and other applications.

The company has announced Phison Electronics Corp. and Sage Microelectronics Corp. will provide native support for the firm’s 1GB STT-MRAM memory, while Cadence Design Systems, Inc. will provide DDR4 Design IP and Verification IP (VIP) support for 1GB STT-MRAM memory. System designers can utilize STT-MRAM in their products with their choice of using standard controllers, designing with FPGA’s, or building their own SoC/ASIC. These announcements represent expansion of the global STT-MRAM ecosystem for the company.

“The Everspin team continues to build strong market support for our ground-breaking 1GB STT-MRAM devices, as we march toward full production of this product,” said Kevin Conley, president and CEO, Everspin. “We are pleased the market is quickly adopting this technology as we launch into volume production in 3Q19.“

The company’s 1Gb product family includes both 8-bit and 16-bit DDR4 compatible (ST-DDR4) interface versions of the device and are available in a JEDEC-compliant BGA package.

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