Interconnect Systems Assigned Patent

Interconnect Systems, Inc./Molex, Camarillo, CA, has been assigned a patent (9,865,310) developed by Cantle, Allan, Westlake Village, CA, Weber, Patrick, Oxnard, CA, Gilliam, Mark, and Joshi, Prashant, Thousand Oaks, CA, for a “high density memory modules.“

The abstract of the patent published by the U.S. Patent and Trademark Office states: “Solid state memory modules are disclosed having increased density for module size/footprint. Different embodiments also provide for improved interconnect arrangements between the memory modules and the corresponding field programmable gate array, (FPGA), micro-processor, (.mu.P), or application-specific integrated circuit, (ASIC). These interconnects provide for greater module interconnect flexibility, operating speed and operating efficiency. Some memory module embodiments according to the present invention comprises a plurality of solid state memory devices arranged on a first printed circuit board. A second printed circuit board is on and electrically connected to the first printed circuit board, with the second printed circuit board having a pin-out for direct coupling to a host device.”

The patent application was filed on February 24, 2012 (13/404,995).