FTDI Launches Single-Chip Solution for USB Full Speed Bridging

FTDI Chip (Future Technology Devices International Ltd.) continues to explore innovative approaches for ensuring that USB technology is as straightforward to use as possible.

The FT260 is a human interface device (HID) class interface controller IC, which complements the company’s expansive vendor class portfolio. It can provide USB 2.0 Full Speed (12Mb/s) connectivity to a broad range of application scenarios – including connection of touchscreens, computer peripherals and IoT sensing apparatus, as well as USB interfacing of micro-controller or programmable logic centric system designs, plus industrial automation equipment and USB instrumentation. Supplied in compact 28-pin SSOP and 28-pin QFN package options, these USB bridge chips have dual HID interface support, with I2C and UART bus conversion capabilities.

As the entire USB protocol is handled on the chip, the FT260 offering presents engineers with a plug-and-play solution that is simple to incorporate into contemporary embedded system designs. These ICs employ standard class drivers, which means it is not necessary to worry about installing complex vendor-specific drivers. Their flexible IOs mean they are compatible with 1.8V to 3.3V systems. During full operation only 24mA of current is drawn and this drops to just 385uA when in suspend mode.

The FT260 is the first device of its kind to be compliant with the HID-over-I2C protocol, as specified by Microsoft Corp. with the release of Windows 8. A total of four different speed modes can be utilized while in I2C bus – standard mode (SM), fast mode (FM), fast mode plus (FM+) and high speed (HS) with 7-bit addressing supported. The integrated memory resource enables storage of customized USB descriptors. The built-in oscillator PLL dispenses with the need for an external crystal – thereby saving space and lowering bill of materials costs.

Furthermore, unlike competing ICs, the FT260 has USB battery charger detection mechanism included, so that more efficient charging may be benefited from. To further assist engineers, this IC will be backed up by a series of board level products.