Spansion and Macronix Reach Settlement Agreement on Patents

Spansion Inc., in non-volatile memory and embedded systems solutions, and Macronix International Co., Ltd., in non-volatile memory semiconductor solutions, have settled all outstanding patent disputes and actions, including their respective complaints at the US International Trade Commission as well as District Court, inter partes review proceedings at USPTO, and Macronix’s patent infringement complaint against Spansion in Germany.

As part of the settlement, both companies agreed to dismiss all patent cases between them and their downstream customers worldwide.

In the agreement, the companies have granted certain rights under the disputed patents to each other. The settlement allows both companies to direct their full attention and resources to continuing to innovate and serving their customers’ needs as leaders in the memory semiconductor industry.

Other terms of the settlement agreement, including financial terms, were not disclosed.

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