Singulus Delivering Sputtering Systems to Singapore’s Data Storage Institute
For the development of MRAM and PCRAM memory device
This is a Press Release edited by StorageNewsletter.com on October 27, 2010 at 3:12 pmSingulus Technologies AG will deliver one of its TIMARIS sputtering systems to the Data Storage Institute (DSI) in Singapore.
This TIMARIS system consists of two specialized deposition modules with 10 sputter cathodes each and one novel module for PVD and simultaneous ion treatment. DSI plans to use this tool for their development of Non-volatile Memories (NVM) and in particular MRAM and PCRAM memory devices. In connection with this installation, SINGULUS and DSI are planning to collaborate on the joint development of leading edge process technologies for these applications.
Singulus, through its Nano Deposition Technologies business unit, is a renowned manufacturer of advanced thin film deposition equipment for MRAM and Thin Film Head production. Its TIMARIS PVD bridge tool system is designed as a flexible cluster tool for all wafers up to ø300 mm. At present six different process modules are available to configure a TIMARIS system according to customers specifications.
These modules include the Multi-Target-Module (MTM, 10 targets in one chamber), the Oxidation Process Module (OPM), PreClean Module (PCM), Combination Process Module (CPM), Flexible-Target-Module (FTM), and Static PVD Module (SPM). Further modules are under development. The TIMARIS system is typically delivered with transport modules as the central wafer handler. The TIMARIS PVD modules (MTM, FTM, SPM) incorporate the full scope of sputtering techniques: DC magnetron sputtering, pulsed DC magnetron sputtering and RF magnetron sputtering as well as combinations of these modes are selectable through a recipe menu.
"We are very proud to have been selected by DSI to install our PVD system, since it proves the high reputation our TIMARIS tool family has in the market," says Dr. Wolfram Maass, Managing Director of the Singulus Nano Deposition Technologies business unit, "The cooperation with DSI will allow us to participate at the leading edge research activities to develop these new types of Non-Volatile memories."
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