USB 3.0 Storage Devices From Taiwanese Company inXtron

In order to stay ahead of the SuperSpeed curve, inXtron, Inc. released its first USB 3.0 product, the SK-3500 at IDE Intel Developer Forum and is rolling out a SuperSpeed 3.0 portfolio at CES 2010.

inXtron has been able to significantly accelerate the release of its USB 3.0 solutions by working closely with GIGABYTE Technology Co., Ltd. on research and development. “GIGABYTE’s USB 3.0 motherboards have allowed us to get into the market with an array of new storage devices. It has been a key to us providing high quality products ready for 2010,” says Tommy Chen, inXtron CEO.

Due to an exponential increase in digital content over the last several years, transferring content using USB 2.0 is proving to be extremely inefficient and time-consuming. This has set the stage for a migration to USB 3.0 technology.

inXtron’s top priority is insuring a smooth transition from the previous HighSpeed USB 2.0 connection to the new SuperSpeed USB 3.0 connection. A critical aspect of this transition is working closely with industry leaders, such as GIGABYTE, to sync up their USB 3.0 roadmaps and allocate all necessary resources to take a leading position in the shift to USB 3.0.

“GIGABYTE is committed to driving innovation with onboard USB 3.0 motherboards, and as such, we are planning over 20 models to cover every market segment at the beginning of Q1 2010,” said Tim Handley, Deputy Director of Motherboard Marketing at GIGABYTE Technology Co. “We commend inXtron on their aggressive USB 3.0 product roadmap and look forward to adding more cutting-edge inXtron products on the GIGABYTE USB 3.0 microsite in future.”

By incorporating USB 3.0 technology into their storage enclosure portfolio, inXtron is now able to deliver products that are the perfect combination of cutting-edge technology, speed, durability and flexibility. At the same time, it is still backwards compatible with the widely used USB 2.0 technology.

inXtron CEO, Tommy Chen, says: “inXtron came out with USB 3.0 enabled external storage enclosures because there is a need that must be filled. We have removed the USB 2.0 barrier with the SuperSpeed USB 3.0 connection.”