Fusion-io With Samsung Flash Chips
For network-attached, solid state storage for servers
This is a Press Release edited by StorageNewsletter.com on May 21, 2009 at 3:47 pmFusion-io is working with its vendor of the year, Samsung Semiconductor, to create the next generation of server-deployed, network-attached solid state storage solutions that build on Samsung’s industry leading, enterprise NAND Flash technology.
Samsung’s NAND chips offer the largest memory capacity and longest lifespan available, while Fusion’s ioMemory controller extends this already exceptional life, adding enterprise level features with unparalleled performance to some of the largest server companies.
Cooperating closely to drive solid state innovation, the two companies are contributing toward a steady evolution from server-attached to server-deployed, network-attached storage. Samsung was selected as Fusion-io’s vendor of the year last month as a result of the extensive support Samsung has provided the company over the past year.
“Samsung’s exceptional level of cooperation has helped us immeasurably in being able to offer an enterprise storage alternative that is more impressive than earlier iterations—a tightly integrated, ultra-fast solid state storage solution with no equal in today’s marketplace,” said David Bradford, Chief Executive Officer of Fusion-io.
“Fusion-io has developed new types of solid state storage products, and our work with them will enable enterprises to take advantage of this innovative technology in the very near future,” said Jim Elliott, Vice President, Memory Marketing of Samsung Semiconductor, Inc.
Fusion’s ioSAN represents the first step in this evolution. This product is a solid state, enterprise-class flash device that places the performance of an entire storage area network (SAN) onto a single PCI Express card with dual integrated 10Gb Ethernet or Quad Data Rate Infiniband network ports.
Fusion-io demonstrated the ioSAN with Samsung’s NAND Flash technology at Interop 2009.