NVIDIA GTC 2025: Solidigm Unveils Liquid-Cooled Enterprise SSDs for AI Deployments

At NVIDIA GTC 2025, Solidigm unveiled one of the world’s 1st liquid-cooled eSSDs helping remove the fans historically needed for storage devices and enabling future fully liquid-cooled AI servers.

Until now, the ability to deploy a completely liquid-cooled training server has been hampered by challenges with certain components. Traditional SSD direct liquid cooling (DLC) designs cool only 1 side of each SSD and prevent hot swapping. To enable more compact designs and decrease cooling costs, it is imperative these servers adopt a complete liquid-cooling approach to enable more compact designs while addressing architectural needs for all the components.

Solidigm has worked with NVIDIA Corp. to address eSSD liquid-cooling challenges, such as hot swap-ability and single-side cooling constraints. At GTC 2025, Solidigm is demonstrating the 1st cold-plate cooled eSSDs featuring the Solidigm D7-PS1010 E1.S 9.5mm form factor.

“Solidigm shows how the combination of an innovative Solidigm E1.S SSD and liquid cold-plate kit — both first-to-market innovations — deliver significant benefits in thermal efficiency while maintaining data center grade serviceability,” said Kevin Noh, co-CEO, Solidigm.

Available for AI servers in the 2nd half of this year, the E1.S SSD and cold-plate kit continue the firm’s packaging innovation leadership that has inspired enterprise SSDs, including Solidigm being the 1st to deploy the ‘ruler’ form factor.

Meanwhile, the D7-PS1010 E1.S will also come in 15mm form factor to add flexibility of design for air-cooled server and storage systems.

GTC attendees can see this Solidigm technology in action and connect with the company’s experts at Booth #1602.