Rigaku Method for Inspecting and Measuring Defects in 3D Flash Memory Wins Diana Nyyssonen Memorial Best Paper Award

Rigaku Corporation, a Group company of Rigaku Holdings Corporation has won the Diana Nyyssonen Memorial Best Paper Award with a revolutionary, non-destructive method of discovering defects in 3D flash memory.

From left: Award recipients Kazuhiko Omote, GM, X-ray Research Laboratory;
and Raita Hirose, Imaging Group, Advanced Analytical Technology Research Department, X-ray Laboratory

The inspection and measurement technology uses an ultra-high-resolution X-ray microscope.

The Award is conferred on the team that delivers the most compelling paper in the fields of measurement, inspection and process control at the SPIE Advanced Lithography + Patterning Conferences. These conferences report the latest research results on lithographic technologies applied in semiconductor manufacturing.

One issue occurring at 3D flash memory production sites is the difficulty of inspecting and measuring the shapes of embedded metal structures and extremely deep holes known as ‘memory holes.’

200nm-scale hole pattern in silicon, inspected and measured using this technology

The technology developed by the Rigaku team achieves ultra-high resolution by employing X-rays, whose detection limit is 1/10 or lower that of the best optical microscopes. In addition to revealing the extremely fine structures of the nanoscale, the technology enables non-destructive observation of devices formed on silicon substrates. The revolutionary nature of this solution is what persuaded the Conferences to confer the award.

Kazuhiko Omote, GM, X-ray Research Laboratory, one of the authors of the paper, states that, “By introducing equipment incorporating this technology, 3D flash memory worksites can expect to enjoy improved yields and optimized production processes. Rigaku targets implementation of the technology in this way in about two years’ time“.

Going forward, Rigaku aims to leverage this technology in pursuit of further innovations, such as application in inspection and measurement of conductance in the connective parts of multilayered devices.

Resource:
Conference paper: Non-Destructive Investigation for Metal Structure in 3D Flash Memory by an Ultra-High Resolution X-ray Microscope (PDF)