Longsys Launches Ultra-thin 0.6mm ePOP4x 7.2mm eMMC

Building on the ultra-compact 7.2×7.2mm eMMC (video), Longsys Electronics Co., Ltd. presents its latest advancement for wearable storage use cases – the ultra-thin 0.6mm (max) ePOP4x (video), which enables a more streamlined and efficient device layout.

Ultra-thin Package, High-integration Design
With a maximum thickness of just 0.6mm, it is nearly 25% thinner than its predecessor (0.8mm), making it one of the slimmest ePOP products available on the market. Compared to conventional storage solutions, ePOP4x utilizes cutting-edge packaging technology and a highly integrated design.

The ePOP4x integrates eMMC and LPDDR4x into a single package, offering mainstream capacities of 32GB+16Gb and 64GB+16Gb. This Flash + DRAM combo, paired with a high-performance controller that supports LDPC error correction, meets the diverse storage and memory demands of wearable devices.

A package on package (PoP) design allows the chip to be directly mounted onto the SoC, significantly reducing the PCB footprint and providing a highly efficient embedded storage solution for space-constrained wearables.

In-house firmware, proprietary packaging and testing
Longsys’ ePOP4x is powered by in-house firmware, delivering fast boot times, ultra-low power consumption, and optimized SoC compatibility for enhanced performance and battery life. Additionally, the ePOP4x offers customizable versions tailored to specific customer requirements, ensuring flexibility and precise storage solutions for various applications.

Backed by its own advanced packaging and testing (OSAT) facilities in Suzhou, the company provides cutting-edge packaging technology and specialized production lines for storage products. This dedicated manufacturing approach ensures stable supply, improves production efficiency, and enables highly customized solutions that meet the diverse needs of wearable device manufacturers.

Through the Product Technology Manufacturing (PTM) business model, the company integrates proprietary storage chips, firmware, hardware, and advanced packaging technologies, delivering storage solutions with a foundry-like model that accelerates product development and market deployment.

From Ultra-compact eMMC to Ultra-thin ePOP4x
From standardized storage to customized innovations, Longsys continues to push the boundaries of wearable storage – from the 7.2mm ultra-compact eMMC to the 0.6mm ultra-thin ePOP4x. These advancements equip wearable devices with thinner, higher-performance, and more efficient storage solutions.

Every incremental technological breakthrough has the potential to drive transformative innovation in wearable devices. Moving forward, the company remains committed to exploring the frontiers of storage technology, continuously challenging physical limits to provide optimized storage solutions for next-gen wearables.