What are you looking for ?
Advertise with us
RAIDON

ATP Electronics Launches E600Vc Series Up to 128GB 7.2mm e.MMC

Up to 290/220MB/s sequential RW speeds, support temperatures ranging from -25°C to 85°C, and compliant with JEDEC e.MMC 5.1 Standard (JESD84-B51)

ATP Electronics, Inc. unveils its latest embedded MultiMedia Card (e.MMC) flash storage in the world’s smallest package — a size comparable to that of a standard die face, with up to 128GB storage capacity.

Atp Electronics Unveils Latest 7.2 Mm E.mmc Intro

The E600Vc is constructed with 3D triple level cell (TLC) flash. Its size of just 7.2×7.2mm is 65% smaller compared to a standard e.MMC package of 11.5×13 mm, breaking dimension limits without compromising on advanced features, such as extremely low power consumption, reliable operation, high endurance, and commendable read/write performance.

Optimized Power Efficiency Tuning
With ATP’s firmware tuning capability, the new e.MMC boasts Auto Power-Saving Mode and Power Optimization technologies to deliver unprecedented energy efficiency when compared to an untuned e.MMC solution, resulting in up to 70% power conservation based on smart wearable applications.

With its remarkable power-saving capabilities, the new e.MMC enhances the host device’s battery life for longer use, as well as supports sustainable and eco-friendly operations.

Rugged, Reliable Mobility
Despite its tiny footprint, the E600Vc Series is loaded with advanced features, making it a solution for a wide range of applications where space and power efficiency are critical. They are perfect for mobile devices requiring long battery life such as smartwatches, fitness trackers, and smartphones.

Atp Electronics Unveils Latest 7.2 Mm E.mmcThe E600Vc Series is compliant with the JEDEC e.MMC 5.1 Standard (JESD84-B51), supporting x1/x4/x8 bus speed modes and featuring High Speed 400 (HS400) DDR Mode for faster programming and improved bandwidths of up to 400MB/s.

With its sturdy construction, the E600Vc performs reliably in a variety of environmental challenges as well as temperatures ranging from -25°C to 85°C. The vibration-proof FBGA package ensures that the soldered-down E600Vc can withstand even the most vigorous shaking.

The E600Vc is available in capacities from 64 to 128GB with maximum sequential RW performance of 290/220MB/s, respectively.

State-of-the-Art Technologies:

  • Breakthrough Power Management. With Auto Power-Saving Mode and Power Optimization technologies, the E600Vc Series consumes less power and adapts power usage according to real-time requirements for optimal performance and energy efficiency.
  • Enhanced Data Integrity. Advanced error correction and wear leveling algorithms ensure data integrity and longevity. AutoRefresh averts read disturbance and data corruption in often-read areas (hot zone), while Dynamic Data Refresh sustains data integrity in seldom-accessed areas (cold zone).
  • Carbon Footprint Reduction. The small form factor, along with its power-saving features, allows the E600Vc to contribute to lower carbon emissions and long-term eco-sustainability. Pin-to-pin compatible and with specifications identical to the existing e.MMC 153-ball design, it can be used as a drop-in replacement for current 11.5x13mm, 9×10 mm or any e.MMC. Its compliance with JEDEC e.MMC v5.1 Standard (JESD84-B51), along with its Power Optimization features, provides an alternative for existing designs and decreases ecosystem impacts with minimum efforts.

The uniqueness of the E600Vc Series matches ATP’s commitment to innovation and to delivering solutions for customers’ memory and storage needs. The company’s e.MMC can be tailored to specific requirements to ensure seamless integration and optimal performance across a wide range of applications.

Product Specs:

Product Line

Value

E600Vc

Flash Type

3D TLC

IC Package

153-ball FBGA

JEDEC Specification

v5.1, HS400

Power Loss Protection

Firmware Based

Operating Temperature

-25°C to 85°C

Capacity

64 to 128GB

Performance

 

Sequential Read/Write up to (MB/s) (Max.)

290/220 (*)

Bus Speed Modes

x1 / x4 / x8

ICC (Typical RMS in Read/Write) mA (Max.)

105/80 (*)

ICCQ (Typical RMS in Read/Write) mA (Max.)

115/95 (*)

Endurance and Reliability

 

Endurance
TBW (Max.)

24TB (*)

Reliability
MTBF @ 25°C

>3,000,000 hours

Others

 

Dimensions (mm)

7.2 x 7.2 x 0.8

Certifications

RoHS, REACH

Warranty

One Year

(*) Product specifications may be subject to change.

Read also :
Articles_bottom
ExaGrid
AIC
ATTO
OPEN-E