Longsys Unveils 7.2mm Up to 128GB Subsize eMMC Breaking Physical Space Constraints of AI Wearables

In the design of wearable devices, every millimeter matters. As AI technology becomes deeply integrated, wearable devices demand not only enhanced performance but also the ability to deliver more functionalities within highly limited spaces.

Longsys Electronics Co., Ltd. introduced a 7.2mm × 7.2mm subsize eMMC, providing a groundbreaking memory solution for optimizing the physical space of AI wearables.

Ultra-compact: Unlocking new possibilities for wearable design
7.2×7.2mm is 1 of the smallest subsize eMMCs currently available on the market, achieving maximum space efficiency. Its 153 solder balls nearly cover the entire panel, pushing the design to the very edge of physical limits. Compared to the standard 11.5x13mm eMMC, its surface area is reduced by approximately 65%, with a thickness of just 0.8mm. Featuring a lightweight design, it weighs only 0.1g (approx.), nearly 67% lighter than the standard 0.3g eMMC. This ultra-compact design frees up additional space for other internal components, enabling wearable devices to maintain a sleek and lightweight form while integrating more functional modules to meet diverse user demands.

Compact yet capable: Balancing capacity and performance
While pursuing an ultra-compact design, the 7.2×7.2mm subsize eMMC does not compromise on performance or capacity. Equipped with in-house firmware, it ensures fast device boot-up, AI application performance, and efficient data processing. Additionally, low-power technologies, such as intelligent sleep and dynamic frequency scaling, significantly reduce energy consumption and extend battery life without compromising performance. With capacities of 64 and 128GB – among the highest for similar compact products – it offers innovative solutions for optimizing AI wearables such as smart glasses, watches, and earphones.

In-house packaging and testing: Leading the industry
Notably, this subsize eMMC is packaged and tested at Longsys’ in-house Suzhou packaging and testing Base, and it adopts a grinding and cutting process to achieve a smaller size. The facility specializes in NAND flash and DRAM packaging and testing while extending its capabilities to eMMC, UFS, eMCP, and ePOP series, offering services across wafer-level, chip-level, and system-level packaging.

PTM full-stack customization: Beyond compactness
Advanced packaging technologies give Longsys a competitive edge in product size, thermal management, compatibility, reliability, and storage capacity. The company’s eMMC products are now highly mature, with 2024 seeing the launch of its proprietary eMMC controllers and QLC eMMC. Beyond compact design, its full-stack customization capabilities extend across product development, technology, and manufacturing to meet diverse client needs.

The launch of the 7.2×7.2mm ultra-compact eMMC represents a new breakthrough for mature products, offering support and enhanced options for AI wearable development. Looking ahead, the company remains committed to memory technology innovation, bringing more exciting possibilities to wearable devices.

Video: Introducing Longsys Subsize eMMC