Avalanche Partners With Trusted Semiconductor Solutions

Avalanche Technology, Inc. announced a partnership with Trusted Semiconductor Solutions, Inc. (TSS) to provide valued DDR3/4 non-volatile memory products hardened to strategic levels for the aerospace & defense community.

Based in Minneapolis, MN and well respected within this community, TSS brings decades of experience in high reliability IC design, product development, and deep expertise in radiation effects.

The Avalanche/TSS partnership was presented last week at the Radiation Hardness Electronics Technologies Conference (RHET), held annually for the US space electronics community and organized by Air Force Research Laboratory (AFRL).

RHET features government organization presentations outlining plans and requirements for Rad-Hard electronic development efforts to support national space and missile system priorities.

By combining Avalanche’s Gen 3 technology with our radiation hardened chiplet, we can develop and deliver strategic rad hard MRAM products.

Building on prior collaborations between Avalanche and TSS, this new product family will address the critical need for radiation resilient, high reliability execution memory with instant-on capability for strategic radiation environments. Leveraging Avalanche’s broadly adopted modular Gen 3 MRAM product architecture TSS will add specialized survivability features required for this application and provide the storefront for this tailored solution.

Firm’s Gen 3 Space Grade MRAM product families leading the market (coined Persistent SRAM) have enabled the aerospace and defense community to overcome decades old bottlenecks caused by the inherent radiation susceptibility issues of legacy memory technologies. These disruptive MRAM solutions consolidate entire memory subsystems to a single device, while also boosting system reliability. Leveraging the Gen 3 family, the company recently announced an 8GB DDR4 DRAM replacement solution for use as execution memory with advanced processors in space, set for release in mid-2025.

Core capabilities of this memory include:

• Built in EDAC functionality to correct multibit soft errors on the fly
• Non-volatile with data committed upon write
• Near infinite write cycle endurance
• SEFI-free performance and no shielding required
• Low power

TSS will develop a custom interface chiplet within the strategic DDR product derivative to enable operation and survivability within this challenging radiation environment. EM units and reference platforms will be made available for evaluation and development through TSS.

“TSS continues to grow its portfolio of solutions for the aerospace and defense community. Layering new capabilities onto commercially available and custom designed integrated circuits, we are able to quickly close critical technology gaps faced by the war fighter,” said Stephanie Pusch, EVP, Trusted Semiconductor Solutions. “Radiation hardened high-performance and high-density NVM is required to support the latest advanced radiation hardened processors found in next gen strategic systems. By combining Avalanche’s Gen 3 technology with our radiation hardened chiplet, we can rapidly develop and deliver strategic rad hard MRAM products.“

“The game-changing impact of our Gen 3 MRAM architecture is enabling system level innovation across the aerospace and defense ecosystem, giving access to advanced NVM with all of the required reliability,” said Paul Chopelas, GM of aerospace and defense products, Avalanche. “As a commercial silicon provider, Avalanche prioritizes agility and collaboration in order to extend our value proposition to more specialized segments with the need for Radiation Hardening. We’re delighted to partner again with the team at Trusted Semiconductor Solutions to bring this platform forward to the Defense Industrial Base.“