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MRAM Maker Selects ClassOne Solstice S8 Single-Wafer System for High-Volume Manufacture of MRAM Devices

To enable optimized copper damascene fill plating for MRAM interconnects

ClassOne Technology, provider of advanced electroplating and wet processing tools for microelectronics manufacturing, announced that an industry-leading provider of MRAM devices has ordered its 1st Solstice S8 single-wafer wet processing system.

Solstice S8 single-wafer system

Classone Solstice S8 Single Wafer System

The customer selected the Solstice system for its ability to deliver repeatable wet processing essential to meeting high-volume manufacturing (HVM) requirements.

The Solstice S8 system configuration will include 3 Gen4 ECD reactors and 3 bevel etch chambers to perform electroplating for copper damascene processes. Used to create copper interconnects in chip fabrication, copper damascene offers benefits for MRAM manufacturing, primarily due to its superior electrical conductivity and reliability in building the interconnect layers. The damascene process allows for precise patterning of copper, which minimizes resistive losses and improves the overall speed and efficiency of MRAM devices. This is crucial for MRAM applications, which rely on fast and efficient data writing and retrieval.

Byron Exarcos, CEO, ClassOne, said: “The Solstice S8 delivers proven plating performance and reliability in copper damascene that the customer’s existing wafer-processing equipment cannot accommodate at the high levels of performance required. With markets like AI and industrial IoT continuing to escalate demand for MRAM, we look forward to playing a role in escalating robust, reliable volume manufacture of non-volatile MRAM.

This latest order closely follows recent Solstice S8 system orders for advanced packaging R&D and for processing glass core technology, illustrating the versatility of the Solstice platform and the breadth of the company’s relationships across industry and university environments alike.

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