OCP Global Summit 2024: Chenbro Showcasing AI Liquid Cooling and Cloud Server Chassis Solutions

Chenbro Micom Co. Ltd. is making its debut at OCP Global Summit 2024 event in the cloud service and server industry, held from October 15 to 17 in San Jose, CA.

At OCP Summit 2024, under the theme ‘AI X Chenbro,’ the company showcased chassis solutions based on the OCP DC-MHS (Data Center Modular Hardware System) and Nvidia MGX architecture, including the 1st-time display of Nvidia MGX 4U liquid-cooled and air-cooled server chassis.

It is also displaying 1U and 2U models supporting GB200 NVL72 and NVL36. Reflecting the theme of this year’s OCP Global Summit, ‘From Innovation to Impact,’ The company is both demonstrating its product development capabilities and collaborating with customers and partners to present co-developed servers. The exhibition features several AI and cloud server solutions jointly created by Chenbro and its partners, underscoring the firm‘s technical expertise and commitment to prosperous growth within the industry.

Launch of DC-MHS and MGX products: Aggressively seizing AI and cloud opportunities

As AI and HPC continue to thrive, data centers are facing unprecedented demands. The OCP DC-MHS architecture is designed to provide stable and efficient computing across a variety of workloads. The company, in collaboration with Intel Corp., developed the 1st DC-MHS platform, and has recently expanded its partnership with AMD (Advanced Micro Devices Inc.) to apply DC-MHS products in AMD’s next-gen platform solutions. Chenbro has introduced several general-purpose computing products based on the DC-MHS architecture and is actively working with numerous brand and SI customers to develop customized products. With the flexible and scalable modular design of DC-MHS, the company has launched server chassis solutions supporting the FLW model with dual-CPU sockets and the DNO model with single-CPU sockets. These solutions also offer high-performance E1.S and E3.S storage modules and highly interoperable modular configurations that meet the needs of cloud service providers and large data center applications.

Additionally, in response to the increasing demand for cooling in data centers, the firm is actively developing both liquid-cooling and air-cooling chassis solutions. As a partner of Nvidia Corp., the company is showcasing 1U and 2U compute trays equipped with GB200 motherboards, designed to fit into MGX racks. These products support liquid and air cooling for CSP data centers, as well as E1.S storage modules, making them for high-performance storage applications. For the 1st time, Chenbro is also unveiling its 4U MGX server chassis, which offers both liquid and air cooling solutions, accommodating up to 16 liquid-cooled or 8 air-cooled PCIe GPU cards. With its flexible modular design and diverse service models, the firm helps clients innovate and design AI server products to meet the various demands of customers and end-user data centers.

Embracing innovative technologies to expand industry influence and foster win-win partnerships
Corona Chen, CEO, Chenbro, stated that this year marks Chenbro’s debut at the OCP Summit, where she is personally leading the team to participate in this prominent event in the IT industry. Chenbro is actively collaborating with Nvidia, AMD, and Intel, with the goal of co-creating and developing AI and HPC server products.

The company is also considering becoming an OCP member, aiming to share product specifications through open standards and make significant progress with OCP members and global customers in the fields of cloud computing and AI servers. At this year’s OCP event, many leading tech companies are showcasing products co-developed with Chenbro, reflecting the firm’s ongoing efforts to strengthen partnerships with its customers. The company continues to invest in the design and development of next-gen products to meet diverse application needs and build a win-win industry ecosystem.

To address the rapidly growing global market demand, Chenbro is actively expanding its overseas operations. The company plans to establish an NCT facility in North America next year to quickly meet the product development needs of US clients. The company is also planning the construction of a new factory in Malaysia to further expand production capacity. This strategic move will enable collaboration with global customers and help seize business opportunities in the AI and cloud server markets.