European Microwave Conference: Kioxia and MoDeCH Develop 3D Probing System

Kioxia Corporation and MoDeCH Inc., developer of modeling and design technology, announced the development of an industry first probing system for high-frequency characteristic measurement for 3D objects up to 110GHz at The European Microwave Conference (EuMC) on September 26.

Figure 1: 3D transmission line between processors and SSDs 2024 EuMA

Conventionally, SSDs in data centers are inserted into high-speed interface connectors on the processor motherboards. In this situation, transmission lines for high-speed interfaces such as PCIe adopt a 3D structure that extends from the motherboards of the processor to the PCBs in the SSDs via orthogonal card-edge connectors. High-frequency characteristics of such 3D structures are typically evaluated by simulations. With the newly developed 3D probing system, it is now possible for the 1st time to directly measure characteristics of 3D structures up to 110GHz.

The 2 companies developed a 3D probe station to measure high-frequency characteristics of the 3D structure. The station incorporates a built-in mechanism that rotates high-frequency probes and frequency extenders together, making contact with a 3D structure in order to measure it.

In addition, the companies developed thru standards for individual 3D structures for accurate measurement of high-frequency characteristics. To evaluate a vertically bent 3D structure, a thru was created on a flexible substrate that was bent vertically using a jig and fixed in place to create a standard thru.

Using the developed 3D probing system and the thru standard for the 3D structure, the newly-developed 3D probing system successfully measured high-frequency characteristics of two transmission lines up to 110GHz on the 2 PCBs that were connected using the orthogonal connector.

This industry-1st development is a result of the “R&D Project of the Enhanced Infrastructures for Post 5G Information and Communication Systems” (JPNP 20017), commissioned by the New Energy and Industrial Technology Development Organization (NEDO).

Note
Y. Sakuraba et al., “A 110GHz Probing System for S-parameter Measurements of Three-Dimensional Objects,” European Microwave Conference 2024 (EuMC 2024), EuMC46-4