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ATP

ATP Industrial N751Pi PCIe Gen4 NVMe M.2 2280 SSDs with 125°C Operating Temperature Range

Comes with standard high endurance rating of 100,000 P/E cycles but can be further configured upon request to achieve endurance of 150,000 P/E cycles, 50% increase.

ATP Electronics, Inc. launches the N751Pi PCIe Gen4 NVMe M.2 2280 SSDs, which set a standard with unmatched endurance among industrial SSDs configured with pseudo single-level cell (pSLC) NAND.

Atp Unveils Industry’s Highest Endurance Industrial Ssd Key Visual V3

The 150,000 P/E cycling configuration of NAND was achieved, thanks to a combination of the company’s strengths – from the use of prime NAND package, stringent NAND IC characterization and 100% NAND screening and validation capabilities, to ATP’s own-developed firmware, specialized hardware configurations, and technologies.

Thanks to their endurance and ability to operate in extreme temperatures, the N751Pi SSDs are for mission-critical and write-intensive applications in harsh environments, rugged conditions, and intense workloads.

Highest-endurance industrial SSD in market
They come with a standard high endurance rating of 100,000 P/E cycles but can be further configured upon request to achieve an endurance of 150,000 P/E cycles – a 50% increase. This enhancement translates to a 75 Drive Writes Per Day (DWPD) for sequential write workloads and 21 DWPD for JESD219A enterprise workloads, all supported by a 5-year warranty.

Atp N751pi Scheme1Superior data retention
With 100% P/E cycles, the N751Pi SSD can store data for up to a year at 55°C, outperforming other storage devices with similar P/E cycles. This data retention capability makes the N751Pi SSD a choice for applications requiring long-term data preservation under challenging environmental conditions.

Thermally engineered for 125°C cross-temperature operating range
From IC selection/screening to firmware optimization and hardware configuration, these SSDs are thermally engineered at every level.

Industrial-grade prime die
Rigorous NAND IC screening ensures top-quality components for extreme conditions

Advanced firmware configuration:

Thermal throttling:
The SSD intelligently adjusts its workload to maintain maximum sustained performance and throughput while preventing overheating. This dynamic approach optimizes performance within safe temperature ranges.

Cross-Temperature error handling:
The company has developed technology to mitigate errors that can occur when SSDs operate across varying temperatures. This is particularly important for scenarios where data is written at low temperatures (-40°C) but read at high temperatures (85°C), which can increase error rates and potentially compromise data integrity over time. The firm’s solution helps maintain data integrity even as the NAND approaches the end of its operational life.

Atp N751pi Scheme2Customizable heatsinks
For better performance in harsh environments, the company offers customizable heatsink options based on customer requests or joint validation results. Available options include 4, 8mm, and copper foil heatsinks.

Hardware-based power loss protection with MCU and PLP circuitry
ATP adoption of microcontroller units (MCUs) in SSDs enhance reliability, performance, and adaptability by enabling advanced power management, data integrity protection, and real-time optimization of drive operations.

MCU in action: Input Power Noise De-glitch mechanism that accurately
distinguishes between actual power loss events and temporary power instabilities.
This prevents false triggers that could cause unnecessary cache flushes
or SSD freezes due to misinterpreted power fluctuations.
Click to enlarge

Atp N751pi Scheme3

Enhanced TLC configuration offering: N651Si/N651Sc
It provides a middle ground for applications that require better-than-average TLC performance and endurance, but do not necessarily need the extreme endurance of pSLC.

This version outperforms other TLC offerings on the market and includes all the advanced features of the N751Pi Series, with capacities ranging from 240GB to 3.84TB.

Product specs:

PCIe Gen4 NVMe M.2 2280 SSD

Product Line

Premium

Superior

Value

N751Pi
(150,000 P/E cycle configuration drive
available on a project basis)

N751Pi

N651Si / N651Sc

N601Sc

N601Vi / N601Vc

Interface

PCIe G4 x4

Flash type

3D TLC (pSLC mode)

3D TLC (pSLC mode)

3D TLC

3D TLC

3D TLC

Form tactor

M.2 2280-D6-M1

M.2 2280-D2-M

M.2 2280-D6-M1

M.2 2280-D2-M

M.2 2280-D6-M1

M.2 2280-D2-M

M.2 2280-D2-M

M.2 2280-S3-M

Operating temperature

-40°C to 85°C

-40°C to 85°C / 0°C to 70°C

0°C to 70°C

-40°C to 85°C / 0°C to 70°C

Power loss protection options

Hardware + firmware based

Firmware based

Hardware + firmware based

Firmware based

Hardware + firmware based

Firmware based

Firmware Based

Firmware Based

Optional SED features

AES 256-bit encryption, TCG Opal 2.0

Capacity

80GB to 640GB

1.28TB

80GB to 640GB

1.28TB

240GB to 1.92TB

240GB to 3.84TB

240GB to 1.92TB

240GB to 1.92TB

Performance

Sequential read (MB/s) up to

6,450

6,450

6,450

6,450

6,450

6,450

6,450

5,000

Sequential write (MB/s) up to

6,050

6,100

6,050

6,100

6,050

6,050

6,050

4,300

Random reads IO/s up to

1,090,000

1,050,000

1,090,000

1,050,000

1,091,000

1,091,000

1,095,000

800,000

Random writes IO/s
up to

1,107,000

1,200,000

1,107,000

1,200,000

1,245,000

1,245,000

1,244,000

1,100,000

Endurance and Reliability

Endurance (TBW)2 up to

90,000TB

180,000TB

60,000TB

120,000TB

9,230TB

17,930TB

5,700TB

4,175TB

Reliability
MTBF @ 25°C

>2,000,000 hours

Others

Dimensions (mm)

80.0 x 22.0 x 3.85
80.0 x 24.4 x 12.5 (with 8mm heatsink)

80.0 x 22.0 x 2.4

Certifications

CE, FCC, BSMI, UKCA, RoHS, REACH

CE, FCC, BSMI, UKCA, RoHS, REACH, UL

Warranty

5 years

2 years

1. M.2 2280-D6-M form factor (max height: 3.85mm), offers Hardware Based Power Loss Protection. M.2 2280-D2-M form factor (max height: 3.6mm), provides Firmware Based Power Loss Protection.
2. Under highest Sequential write value. May vary by density, configuration and applications.

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