Micron Shipping 128GB DDR5 Critical Memory for AI Data Centers

Micron Technology, Inc. has validated and shipped its high-capacity monolithic 32Gb DRAM die-based 128GB DDR5 RDIMM memory in speeds up to 5,600MT/s on leading server platforms.

Powered by the company’s 1β (1-beta) technology, the 128GB DDR5 RDIMM memory delivers more than 45% improved bit density, ⁽¹⁾ up to 22% improved energy efficiency ⁽²⁾ and up to 16% lower latency ⁽¹⁾ over competitive 3DS through-silicon via (TSV) products.

Micron’s collaboration with industry leaders and customers has yielded adoption of these new high-performance, large-capacity modules across high-volume server CPUs. These fast memory modules were engineered to meet the performance needs of a range of mission-critical applications in data centers, including AI and ML, HPC, in-memory databases (IMDBs) and efficient processing for multithreaded, multicore count general compute workloads. The 128GB DDR5 RDIMM memory will be supported by an ecosystem including AMD, Hewlett Packard Enterprise, Intel, and Supermicro.

“With this latest volume shipment milestone, Micron continues to lead the market in providing high-capacity RDIMMs that have been qualified on all the major CPU platforms to our customers,” said Praveen Vaidyanathan, VP and GM, compute products group, Micron. “AI servers will now be configured with Micron’s 24GB 8-high HBM3E for GPU-attached memory and Micron’s 128GB RDIMMs for CPU-attached memory to deliver the capacity, bandwidth and power-optimized infrastructure required for memory intensive workloads.”

“A core tenet of our work with Micron is advancing the capabilities of data center infrastructure through highly-performant memory for compute intensive workloads,” said Dan McNamara, SVP and GM, server business unit, AMD (Advanced Micro Devices Inc.). “Through this collaboration, our joint customers can now get immediate impact out of the high-capacity DDR5 memory offering from Micron in an AMD EPYC CPU powered server, delivering the performance and efficiency needed for the modern data center.”

“Adopting advanced memory capabilities, while ensuring high-performance and efficiency, is critical to supporting growing AI workloads in training, tuning, and inferencing,” Krista Satterthwaite, SVP and GM, compute, HPE (Hewlett Packard Enterprise Development LP). “We are committed to providing the most high-performing, energy-efficient solutions, and through our collaboration with Micron, plan to deliver monolithic, high-density DRAM across our AI portfolio to help our enterprise customers gain optimal performance to tackle any workload.”

“Micron’s 128GB DDR5 RDIMM memory is the first 32Gb monolithic DRAM-based high-capacity DIMM that has completed Intel platform memory compatibility qualification on 4th and 5th Gen Intel Xeon processors,” said Dr. Dimitrios Ziakas, VP, memory and io technologies, Intel Corporation. “32Gb density based DDR5 DIMMs accelerates critical server and AI system configurations bringing forward key performance, capacity, and most importantly power efficiency benefits to Intel Xeon processor-based systems. We are excited to continue our collaboration with Micron to drive broad adoption of innovative products in the market that solve memory capacity and power bottlenecks for AI and server customers.”

“Supermicro is leading the industry with the broadest accelerated server and solution portfolio based on NVIDIA, AMD and Intel,” said Wally Liaw, SVP, business development and co-founder, Supermicro (Super Micro Computer, Inc.). “Savvy customers are looking for large memory footprint, performance, and efficiency improvements in the AI infrastructure. Customers can benefit significantly from Supermicro’s advanced GPU SuperServers with the new 32Gb monolithic DRAM-based 128GB memory, and we are excited to collaborate with Micron to enable this.”

The company’s 128GB DDR5 RDIMM memory is available directly from the firm and will be available through select global channel distributors and resellers in June 2024.

As part of its data center memory portfolio, the firm offers an array of memory options across DDR5 RDIMMs, MCRDIMMs, MRDIMMs, CXL and LPDDR5x form factors to allow customers to integrate optimized solutions for AI and HPC applications that suit their needs for bandwidth, capacity and power optimization.

⁽¹⁾ Based on competitive data sheets and JEDEC specifications.
⁽²⁾ Micron 5,600MT/s 128GB DDR5 RDIMM memory compared to SK hynix’s 5,600MT/s 3DS TSV product yields 22.2% better power efficiency.

Resources:
DDR5 webpage
TEP (Technology enablement program) webpage   
Product brief