NHK Spring Assigned Two Patents

Disk drive suspension including flexure with electrode connection portion that has regions of different thicknesses
NHK Spring Co., Ltd., Kanagawa, Japan, has been assigned a patent (11869549) developed by Sugiyama, Shinji, Tanaka, Naoki, Sugiyama, Kazuhiro, and Numata, Shuntaro, Yokohama, Japan, for a “disk drive suspension including a flexure with an electrode connection portion that has regions of different thicknesses.“

The abstract of the patent published by the U.S. Patent and Trademark Office states: “A suspension for a disk drive includes a plate member having a first surface, a second surface opposite to the first surface, a first penetration portion penetrating the first surface and the second surface, and a second penetration portion spaced from the first penetration portion and penetrating the first surface and the second surface, an actuator provided on the second surface and having an electrode located in the first penetration portion, and a flexure having an electrode connection portion connected to the electrode. The electrode connection portion includes a first region and a second region having a thickness smaller than a thickness of the first region, and the second region overlaps the second penetration portion.”

The patent application was filed on 2023-03-01 (18/176800).

Flexure of disk drive suspension and disk drive suspension
NHK Spring Co., Ltd., Kanagawa, Japan, has been assigned a patent (11848035) developed by Yamada, Yukie, Yokohama, Japan, for “flexure of disk drive suspension and disk drive suspension.“

The abstract of the patent published by the U.S. Patent and Trademark Office states: “A flexure of a disk drive suspension includes a metal base, and a wiring portion provided along the metal base. The wiring portion includes a base insulating layer, a conductor layer overlapping with the base insulating layer, and a cover insulating layer overlapping with the conductor layer, and the metal base includes a pair of first portions having side surfaces opposed to each other. At least one of the base insulating layer and the cover insulating layer is in contact with the side surfaces between the pair of first portions, and the conductor layer does not overlap with the metal base in a direction of stacking the wiring portion.”

The patent application was filed on 2022-11-15 (17/987672).