Mobile World Congress: Kioxia Showcasing SAS and Enterprise SSDs, UFS 4.0 and e-MMC Solutions

Kioxia Europe GmbH will be at this year’s Mobile World Congress (MWC) 2024, the mobile technology and connectivity event.

It takes place on February 26-29 2024 in Barcelona, Spain.

This year, the company will again present its products at the Hewlett Packard Enterprise (HPE) booth. Learn more about the firm’s cooperation with HPE on the International Space Station (ISS). The firm’s lineup of Value SAS SSDs (RM, CM and XG) are available in HPE Spaceborne Computer-2.

The company’s key speakers are available for a 30-60mn briefing to introduce you to the company’s new SSD products and technologies. Interviews on Embedded Memory products (UFS and e-MMC) will be only possible digitally after the event.

Focus on following topics:

• SAS SSDs in HPE Spaceborne Computer-2: Kioxia line-up of RM, CM and XG SSDs on EdgeLine and ProLiant servers from HPE.

• Enterprise SSD line-up and Data Center SSD Lineup with a focus on Enterprise and Datacenter Standard Form Factor (EDSFF) E3.S.

• UFS 4.0: Universal Flash Storage (UFS) 4.0 is a JEDEC-standard, non-volatile managed flash device for high-performance embedded applications – including smartphones, automotive, tablets, smart speakers and AR/VR.

• e-MMC for consumer applications: Solution for applications requiring less density such as streaming media devices, printers, wearables, IoT devices, and many other applications.