Phison Unveils Range of UFS Storage Controllers for Mobile Storage Performance
Including UFS 3.1 PS8325, UFS 2.2 controller PS8327, UFS 3.1 PS8329, and UFS 4.0 PS8361 controllers
This is a Press Release edited by StorageNewsletter.com on February 7, 2024 at 2:01 pmPhison Electronics Corp. introduced a range of UFS (Universal Flash Storage) controllers (PS8325, PS8327, PS8329, PS8361).
These UFS solutions support entry-level, middle, premium and flagship smartphone devices to achieve maximum performance in mobile storage and enhance user experiences.
As smartphone devices require higher performance, the storage devices of many entry-level 5G models have transitioned from eMMC to UFS 2.2 storage, and even flagship models of 4G phones have begun adopting the UFS 2.2 spec. Compared to the half-duplex mode of eMMC, the full-duplex mode of UFS 2.2 increases read speeds by 3x, not only handling smartphone functions that require processing large amounts of data (such as high-resolution recording and video playback), but also consuming lower power under the same performance speed as eMMC. This helps improve the battery life of smartphones and tablets, meeting the high-performance and low-power consumption needs of mobile devices.
In response to the evolving storage requirements of smartphones, the company has introduced the cost-effective UFS 2.2 controller PS8327, offering the highest performance-to-cost ratio in history to meet the growing demand for high-speed mobile storage. Utilizing a 22nm process, the PS8327 is the smallest UFS 2.2 controller, achieving UFS 2.2 speeds of 1,000MB/s under the conditions of a single channel and low-capacity 64GB storage. The company’s suite of UFS storage solutions provide advantages, including cost-effectiveness, performance, and low power consumption for mobile devices.
Additionally, the PS8327 features the firm‘s in-house 6th–Gen LDPC ECC engine, providing more reliable error correction capabilities. It supports existing NAND product specs from various NAND manufacturers and is expected to support upcoming next-gen NAND product specifications.
“With over a decade of R&D experience in the UFS field, Phison has established credible expertise in the development, validation, and technical capabilities of NAND controllers”, said K.S. Pua, CEO. “The UFS 2.2 PS8327 controller, represents the culmination of Phison’s decade experience of UFS research and development that has garnered significant industry praise. Coupled with Phison’s track record of having numerous UFS storage solutions validated by major smartphone chipset suppliers, the PS8327 controller was quickly adopted and deployed by prominent NAND manufacturers upon its release. It is anticipated that mobile devices equipped with Phison’s PS8327 UFS storage solution will be highly competitive in the market.”
In addition to the PS8327, the vendor is debuting 4 UFS controllers this year: PS8325, PS8327, PS8329 and PS8361. This lineup upgrades the competitiveness of its existing UFS product line. From entry-level to flagship smartphones, each category has an optimal UFS storage solution to meet consumer needs.
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UFS 3.1 PS8325: Catering to high-end smartphones, it features TSMC’s 12nm process and a dual-channel design. It supports the latest 1Tb NAND from various NAND manufacturers, achieving a total capacity of 1TB with the fewest NAND chips. Additionally, it boasts company’s self-developed 4KB LDPC error correction engine, providing advanced and powerful ECC error correction capabilities, significantly enhancing the stability and lifespan of smartphone storages. PS8325 has already secured design wins from many international smartphone manufacturers and is expected to start mass production in 1Q24.
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UFS 3.1 PS8329: Focuses on the mid-range smartphone market. Using a 22nm process, PS8329 is a small UFS 3.1 controller with the same specifications. PS8329 achieves RW speeds exceeding 2,000MB/s through a single-channel configuration. Additionally, the 4K LDPC ECC error correction engine provides compatibility and performance with next-gen NAND flash. PS8329 is planned to begin sampling in June 2024.
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UFS 4.0 PS8361: It targets the highest specs of the flagship smartphone market. With TSMC’s 12nm process and a 4-channel design, the highest RW speeds of PS8361 will exceed 4,000MB/s, 2x the performance of UFS 3.1. This fulfills various requirements for high-speed data transfer, quick app launches, multitasking, etc., reducing wait times for loading applications and providing consumers with the most seamless experience. At the same time, under the improved read performance per mA, PS8361 will effectively extend the battery usage efficiency of mobile devices. It has already been designated for use by NAND manufacturers and is expected to begin shipping in 2H24.