Teamgroup: Industrial P745 NVMe 1.4 PCIe Gen 4×4 Up to 4TB M.2 SSD

Teamgroup, Inc. has employed its R&D capabilities and manufacturing processes to launch the industrial P745 SSD, which combines 112-layer 3D NAND flash memory, PCIe Gen 4×4 level speeds, and 8-channel controllers, emphasizing high transfer speeds, power efficiency, and low latency.

The device delivers sequential RW speeds of up to 7,000MB/s and 6,200MB/s, respectively, delivering IO/s performance. To meet the demands of AI applications, temperature control was enhanced to maintain stable and fast performance. In the rapidly developing era of AI and HPC, the company continues to provide best industrial storage solutions.

The device is available in both standard temperature (0°c to 70°C) and wide temperature (-40°C to 85°C) models. It integrates the company’s cooling technology, the patented graphene and fin heat sinks, resulting in a temperature reduction of about 8–15% compared to common products without fin heat sinks. It can be configured to meet the needs of different application environments, enabling the product to maintain stable operation at high temperatures and high performance.

It is also equipped with advanced firmware that protects data by automatically adjusting speeds when temperatures exceed the safe range. With a maximum capacity of 4TB, it is an NVMe 1.4 drive that uses the PCIe Gen 4×4 interface and is backward compatible with PCIe 3.0 platforms. It features a built-in DRAM cache buffer for fast AI computing that enhances system loading and data caching, reducing NAND flash wear and increasing product life span. In addition, it is equipped with an LDPC error correction function and AES 256-bit high-level encryption technology to ensure the accuracy and security of data transmission.

The P745 SSD delivers performance and can be paired with a range of DDR4 and DDR5 memory modules to form a complete storage solution that meets the demands of various industrial applications. Generative AI and HPCs have evolved rapidly in recent years as processors and chipsets have changed. Leveraging its R&D capabilities to innovate, the company strives to add value and diversity to its industrial product line by providing a variety of options with stability and reliability.