Everspin Expands Industrial STT-MRAM with EMxxLX Devices

Everspin Technologies, Inc. is expanding its industrial, high-density STT-MRAM product family, the EMxxLX.

EMxxLX devices

The EMxxLX product, announced last year, is a high-performance persistent memory available. It is for electronic systems where data persistence and integrity, low power, low latency, and security are paramount, such as industrial IoT, network/enterprise infrastructure, process automation and control, aeronautics/avionics, medical, gaming, and FPGA configuration.

DFN package for EMxxLX family

The industry’s first xSPI serial interface based on the company’s STT-MRAM technology is a commercially available persistent memory with RW bandwidth of 400MB/s via 8 I/O signals with a clock frequency of 200MHz. The extended EMxxLX family of devices delivers a combination of performance, endurance, and retention and is available in densities from 4 to 64Mb with new, smaller packaging for the 4-to-16Mb products. The new 5x6mm DFN package is an area savings of 37% over the existing offering. In addition to the new capacity and smaller packaging, the firm is delivering an extended temperature range in the EMxxLX products of -40⁰C to 105⁰C. The EMxxLX family can replace alternative solutions, such as SRAM, BBSRAM, FRAM, NVSRAM, and NOR flash devices.

“In the fast-growing Industrial IoT and embedded systems markets, customers, more than ever, need to protect critical system data under all conditions, particularly in the event of power loss and without concern for wear out or data integrity issues,” emphasized Sanjeev Aggarwal, president, and CEO. “That’s why we are proud to announce the expansion of our EMxxLX MRAM product line, now featuring not only SRAM-like performance with low latency and the ability to maintain memory without requiring power but also an extended temperature range to cater to diverse environmental demands. With the addition of a 4Mb capacity option, our MRAM devices provide even more options to select the optimal density solutions. They continue to deliver extremely high endurance, remain compatible with other memory types, and offer ease of integration into customers’ designs.”

Availability:

• The company is sampling the 4Mb capacity option with the smaller DFN package with production planned for 1Q24.

• The 8Mb through 64Mb capacity options with the extended temperature range are available for production orders.