Flash Memory Summit: Kioxia Fuels Future of Next-Gen Applications

At Flash Memory Summit 2023, Kioxia America, Inc. showcases how its technology is supporting advancements and improvements in a range of market segments, including mobile computing, the edge, the cloud, data centers and automotive.

Highlights will include advances to the company’s BiCS FLASH 3D flash memory, the most recent gen of its automotive UFS devices and the newly announced CD8P data center SSDs.

The company invented flash memory 35 years ago, and is committed to making memory solutions that enable the applications of tomorrow. Innovative new products, form factors, and solutions from the firm are supporting what comes next for data centers, automotive, mobile applications, IoT, AI, industrial automation and more.

“Flash memory continues to be a disruptive technology – even decades later,” said Scott Nelson, EVP and CMO. “High-density, scalable storage technology from Kioxia is enabling new applications in both emerging and existing markets. For example, the latest gen of our BiCS FLASH 3D flash memory addresses the most challenging issues facing data-centric applications by delivering the industry’s highest bit density ⁽¹⁾. The groundbreaking architectural innovations we made here deliver a major leap in performance, density and cost-effectiveness – another proof point in our journey to always make the next thing possible.”

At FMS, the company will give keynote presentation and several educational sessions covering range of topics:

FMS keynote presentation:
Kioxia: Making the Future of Flash
August 8
Shigeo (Jeff) Ohshima, technology executive, SSD application engineering, Kioxia, will present a keynote session

Educational sessions by Kioxia:

Automotive technology track:
Mobile Flash Memory Technology: What is UFS 4.0, and How Can it Benefit Your Application?
August 8, Automotive Panel Part 2 – Speaker: Kevin Hsu

Data center track
Design a Flash-Centric Storage Architecture for an Optimized Cloud Data Center
August 8, _DCTR-102-1: Hyperscale Applications Part 2  – Speaker: Sam Bhattarai

Systems architectures track
Applications, Use Cases and Benefits of a Linux Foundation- Managed Open Source, Software-Defined Flash Solution
August 8, – SARC-103-2: Memory and Storage – Speakers: Sean Stead and Earle Philhower

Flash memory architectures track
A Software-Defined Flash Architecture Tuned for Hyperscale
August 10, – INVT-303-1: Invited Talk – Speaker: Rory Bolt

Networks and connections track
RAID Offload: Saving CPU Cores While Reducing DRAM Bandwidth and TCO
August 10, – NETC-303-1: NVMe Flash Challenges – Speaker: Mahinder Saluja

Booth demos
Product and technology demonstrations will be given in the 2-level Kioxia booth – featuring 8 separate exhibit locations – on the show floor at the Santa Clara Convention Center, CA, from August 8-10 and include:

• Next-gen BiCS FLASH 3D flash memory: Display showing CMOS Bonded Array (CBA) architecture and a lateral density model.
• CM7 Series E3.S enterprise NVMe SSDs: Live demo with Xinnor and SuperMicro highlighting the EDSFF form factor.
• CM7 Series enterprise NVMe SSDs: Live demo with NeuroBlade running an analytics workload.
• CD8P Series data center SSDs: Live demo highlighting the performance of this newly released product.
• Kioxia CXL solutions: Introduction to BiCS FLASH 3D flash memory and XL-FLASH high-bandwidth, low-latency CXL solutions.
• Spaceborne Computer-2 program: Kiosk demonstration that details how HPE and the company are working together on the HPE Spaceborne computer-initiative in the International Space Station.
• Kioxia XFMEXPRESS XT2: Live demo showing XFM DEVICE Ver.1.0-compliant removable PCIe attached, NVMe storage device.
• Kioxia automotive UFS: AEC-Q100 Grade 2 compliant UFS device on a Qualcomm Snapdragon SA8295P automotive development platform.
• Kioxia flash hardware: Showcasing flash hardware to support the Linux Foundation’s Software-Enabled Flash Open Source Project.

⁽¹⁾ Source: As of March 30, 2023. Kioxia survey.