ATP Electronics N601 Series Up to 3.84TB M.2 2280 and Up to 7.68TB U.2 176-Layer PCIe Gen 4 x4 NVMe Industrial SSDs

ATP Electronics, Inc. introduces its fast N601 Series M.2 2280 and U.2 SSDs sporting the 4^th gen PCIe interface and supporting the NVMe protocol.

These PCIe Gen 4 SSDs’ 16GT/s data rate is double that of the previous-gen, translating to a bandwidth of 2GB/s for every PCIe lane.

Using x4 lanes, these SSDs have a maximum bandwidth of 8GB/s, meeting the growing need for high-speed data transfer in today’s demanding applications and making them for both RW-intensive, mission-critical industrial applications such as networking/server, 5G, data logging, surveillance, and imaging, with performance on par, if not better, than mainstream PCIe Gen 4 consumer SSDs in the market.

N601 and N651 Series PCIe Gen 4 X4 M.2 2280 SSDs

176-Layer NAND flash, onboard DRAM offer QoS, lower cost/GB with prime 512Gb die package
The N601 Series is built on 176-layer 3D NAND flash and uses prime 512Gb die package to deliver performance improvements over the 64-layer technology, and also price improvements resulting in lower cost/GB.

The M.2 2280 SSDs are available in capacities from 240GB up to 3.84TB, while the U.2 SSDs are available from 960GB to 7.68TB for more cost-effective options for diverse storage requirements.

With a QoS rating compared with the previous-gen, the N601 Series offers consistency and predictability with higher RW performance, high IO/s, low write amplification index (WAI), and low latency, thanks to its onboard DRAM. The onboard DRAM delivers higher sustained performance over long periods of operation compared with DRAM-less solutions.

 N601 and N651 Series PCIe Gen 4 X4 U.2 SSDs

Future-ready, long-term supply support
Maximizing SSD lifespan, as well as the availability of replacement units long after similar consumer-grade counterparts have stopped production, is important for business to get the most out of their investments. This is why the company is committed to longevity support.

“We are thrilled to introduce this new product line based on 176-layer triple level cell (TLC) NAND flash. While there are newer iterations of NAND being released in 2XX+layers , these will focus on 1Tbit and larger density sizes. The 176-layer 3D TLC NAND in 512 Gbit density remains the sweet spot die density for many embedded and specialty applications given their ongoing need for mid and lower SSD device densities. Besides a competitive price position, this generation will offer latency improvements and reliability improvements at all temperature ranges. Perhaps even more important to our customer base, this generation will offer product longevity for the foreseeable future. We can work in confidence with our customer base often needing product longevity planning 5 plus years,” said Jeff Hsieh, president and CEO.

Reliable and secure operation
The N601 Series offers a host of reliability, security, and data integrity features, such as:

• End-to-end data protection, TRIM function support, and LDPC error correction
• Anti-sulfur resistors repel the damaging effects of sulfur contamination, guaranteeing continued dependable operation even in environments with high sulfur content
• Hardware-based AES 256-bit encryption and optional TCG Opal 2.0/ IEEE 1667 security for self-encrypting drive (SED)
• N601Sc Series offers reliable operation in varying temperature shifts with C-Temp (0℃ to 70℃) rating. I-Temp operable (-40℃ to 85℃) N651Si Series will be available for later release.
• Thermal throttling intelligently adjusts the workload per operating unit time. Throttling stages are pre-configured, allowing the controller to effectively manage heat generation to keep the SSD cool. This ensures stable sustained performance and prevents the heat from damaging the device. Heatsink options are available by project and according to customer request.
• Power loss protection (PLP) Mechanism. The N601 Series U.2 and upcoming I-Temp rated M.2 2280 SSDs feature hardware-based PLP. Onboard capacitors hold up power long enough to ensure that the last read/write/erase command is completed, and data is stored safely in the non-volatile flash memory. The microcontroller unit (MCU)-based design allows the PLP array to perform intelligently in various temperatures, power glitches, and charge states to protect both device and data. C-Temp rated M.2 2280 SSDs, on the other hand, feature a firmware-based PLP, which effectively protects data that had been written to the device prior to power loss.

Mission-critical applications: We build with you
Depending on project support and customer request, the company can provide hardware/firmware customization, thermal solutions customization, and engineering joint validation and collaboration.

To ensure design reliability for mission-critical applications, the firm performs testing, comprehensive design/product characterization and specs validation, and customized testing in mass production (MP) stage, such as burn-in, power cycling, specific testing scripts, and more.

Product Highlights

	PCIe® Gen 4 NVMe M.2 2280	PCIe® Gen 4 NVMe U.2
Capacities	240GB to 3.84TB	960GB to 7.68TB
Operating temp	C-Temp (0°C to 70°C): N601Sc I-Temp (-40°C to 85°C): N651Si (upcoming)
Thermal management for optimal heat dissipation	• Nickel-coated copper heat spreader • 4 mm or 8 mm fin-type heatsink design	15 mm fin-type heatsink design
Security	AES 256-bit encryption TCG Opal 2.0
Data integrity	End-to-End data path protection
Performance (RW up to)	6,450/6,050MB/s	6,000/5,500MB/s
Others		Hot-swappable

*By Project Support