Team Group T-Force Cardea Z540 M.2 PCIe 5.0 2TB SSD

Team Group, Inc. launched the T-Force Cardea Z540 M.2 PCIe 5.0 SSD.

Developed with technological expertise, it is the SSD gamers have been waiting for. Now it’s ready to lead the consumer SSD market into the new era of Gen5.

The Z540 PCIe 5.0 SSD uses the PCIe Gen 5 x 4 interface and supports the NVMe 2.0 protocol, allowing it to reach read and write speeds of up to 12,000MB/s and 10,000MB/s respectively, nearly double the theoretical speed limit of PCIe 4.0.

The T-Force Cardea Z540 M.2 PCIe 5.0 SSD is equipped with a thin graphene heat spreader that combines multiple patented ^[1] technologies. It’s made of 100% recyclable graphene material and utilizes the advantages of hexagonal honeycomb lattice structures to rapidly and evenly disperse heat horizontally, providing Z540 SSD with top-notch cooling.

The Z540’s ultra-thin graphene heat spreader is less than 1mm thick and is compatible with various PCIe 5.0 motherboard heatsinks. Based on T-Force Lab’s internal testing, the operating temperature of Z540 SSD combining motherboard heatsink and graphene heat spreader is 3–5°C lower than the temperature with only motherboard heatsinks ^[2].

Moreover, Cardea Z540 uses the latest intelligent thermal regulation technology with built-in temperature sensing to automatically adjust performance and prevent overheating. The firm has created numerous temperature solutions for the product to not only enhance and protect data integrity of the SSD but also maintain good operating temperatures at high speeds, extending the lifespan of the SSD.

The Z540 M.2 PCIe 5.0 SSD supports the patented S.M.A.R.T. monitoring software ^[3], allowing users to track the health and performance of the SSD. With a 5-year warranty, gamers can enjoy the powerful speeds of Gen5 without worries.

The first batch of Cardea Z540 M.2 PCIe 5.0 SSD will be available in the 2TB capacity and be sold WW in 2Q23.

^[1] Patented Graphene Heatsink U.S. invention patent No.: US11051392B2, Taiwan invention patent No.: I703921, China utility model patent No.: CN 211019739 U
^[2] The temperature reduction will vary depending on the design of each motherboard heatsink. This data is obtained from T-Force Lab using the following test setup specifications: CPU Model: Ryzen7 7700 X, motherboard model: ASRock X670E Taichi / ASUS X670P / Gigabyte X670 AORUS PRO AX, and SSD, and T-Force Cardea Z540 M.2 PCIe 5.0 SSD
^[3] S.M.A.R.T. Taiwan invention patent No.: I751753