ATP N700 and N600 Series 3D TLC PCIe 3.0 x4 NVMe Up to 480GB M.2 SSDs
Also company offers M.2 Type 1620 HSBGA SSDs with same firmware and NAND configuration.
This is a Press Release edited by StorageNewsletter.com on August 11, 2022 at 3:11 pmATP Electronics, Inc. introduces 3D TLC flash storage SSDs: the N700 and N600 Series, which support the speed PCIe 3.0 interface x4 lanes and NVMe protocol.
They offer hardware-based security features, such as ‘Write Protection’ and ‘Quick Erase’, by project and customer request. Enabled through the GPIO pins, ‘HW Write Protect’ puts the SSD in ‘Read Only’ mode, thus preventing the modification or tampering of stored data. ‘HW Quick Erase’, on the other hand, initiates a block-by-block data pattern write operation to systematically erase any trace of user data.
Available as M.2 2230 modules, they offer power efficiency and are for applications using small and light systems such as POS systems, mobile PCs, IoT devices, and server boot applications.
The N700 and N600 Series accommodate a heatsink ball-grid array (HSBGA) on the M.2 2230 form factor. For customers who prefer a soldered-down, vibration-proof solution, the company also offers M.2 Type 1620 HSBGA SSDs with the same firmware and NAND configuration.
The N700 Series is configured as pSLC NAND flash for increased reliability and endurance. It is available in capacities of 40/80/160GB, supports I-Temp ranges from -40°C to +85°C (N700Si) as well as C-Temp from 0°C to +70°C (N700Sc), and offers maximum endurance of up to 4,280TB.
The N600 Series in native TLC is available in capacities of 120/240/480GB, supports C-Temp operating temperature ranges from 0°C to +70°C, and offers maximum endurance of up to 768TB.
N700/N600 Series SSDs are built and thoroughly tested to withstand the demands of industrial applications even in harsh operating conditions.
N700 series key features
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pSLC Mode for higher reliability and endurance
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Sustainable performance with the firm’s Optimized Thermal Throttling firmware (FW), which prevents drastic performance drops that adversely impact the system
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Low power consumption at just 5mW under Power State 4 (Sleep Mode) delivers huge power savings
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Host Memory Buffer (HMB) support for DRAM-less SSDs improve random read performance
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Support for additional power signals to protect data against forced shutdowns.
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Power Loss Notification (PLP_INIT#) – allows the host to initialize the flushing of data to the SSD before powering off.
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Power Loss Acknowledge (PLP_FBCK#) – the SSD provides a signal that indicates the status of preparation for a power loss and starts flushing data after PLP_INIT# is executed.
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Customizable Options (by request and project support)
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HW Write Protect
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HW Erase
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Quick Erase
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Secure Erase (AFSSI-5020)
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AES-256 encryption
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TCG Opal 2.0
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N600 series key features
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Sustainable performance with the firm’s Optimized Thermal Throttling firmware (FW), which prevents drastic performance drops that adversely impact the system
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Low power consumption at 5mW under Power State 4 (Sleep Mode) delivers power savings
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Host Memory Buffer (HMB) support for DRAM-less SSDs improve random read performance
Product specs:
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M.2 2230
Product Line
Superior
Value
N700Si
N700Sc
N600Vi
N600Vc
Interface
PCIe G3 x4
PCIe G3 x4
PCIe G3 x4
PCIe G3 x4
Flash Type
3D TLC
(pSLC mode)
3D TLC
(pSLC mode)
3D TLC
(TLC Mode)
3D TLC
(TLC Mode)
Form Factor
M.2 2230-S4-M
M.2 2230-S4-M
M.2 2230-S4-M
M.2 2230-S4-M
Operating Temperature (Tcase)1
-40°C to 85°C
0°C to 70°C
-40°C to 85°C
0°C to 70°C
Power Loss Protection Options
Firmware Based
Firmware Based
Firmware Based
Firmware Based
Optional SED Features
AES 256-bit Encryption, TCG Opal 2.0
AES 256-bit Encryption, TCG Opal 2.0
–
–
Capacity
40/80/160GB
40/80/160GB
120/240/480GB
120/240/480GB
Performance
Sequential Read (MB/s) up to
2,000
2,000
2,000
2,000
Sequential Write (MB/s) up to
1,600
1,600
1,570
1,570
Random Reads IO/s (4K, QD32) up to
135,600
135,600
135,600
135,600
Random Writes IO/s (4K, QD32) up to
112,000
112,000
112,000
112,000
Endurance and Reliability
Endurance (TBW)2 up to
4,280TB
4,280TB
768TB
768TB
Reliability
MTBF @ 25°C>1,500,000 hours
>1,500,000 hours
>1,500,000 hours
>1,500,000 hours
Others
Dimensions:
LxWxH (mm)30.0×22.0x2.5
30.0×22.0x2.5
30.0×22.0x2.5
30.0×22.0x2.5
Certifications
CE, FCC, BSMI, UKCA, RoHS, REACH
CE, FCC, BSMI, UKCA, RoHS, REACH
CE, FCC, BSMI, UKCA, RoHS, REACH
CE, FCC, BSMI, UKCA, RoHS, REACH
Warranty
2 years
2 years
2 years
2 years
1 Case Temperature, the composite temperature as indicated
by SMART temperature attributes.
2 Under highest Sequential write value. May vary by density, configuration,
and applications.