Kioxia Sampling UFS V.3.1 Embedded Flash Memory Devices for Automotive Applications
From 64 to 512GB, support temperature from -40°C to +105°C, and sequential RW speeds improved by 2.2x and 6x respectively over previous gen devices
This is a Press Release edited by StorageNewsletter.com on April 8, 2022 at 2:01 pmKioxia Corporation started sampling [1] Automotive Universal Flash Storage [2] (UFS) V.3.1 embedded flash memory devices.
This line-up utilizes the company’s BiCS FLASH3D flash memory and is available in capacities from 64 to 512GB to support the various requirements of evolving automotive applications that elevate driver experiences.
The storage requirement for automotive applications continue to increase as infotainment systems and ADAS [3] in cars become more sophisticated. UFS is suited to support the high-performance and density needs of these applications. These devices support a temperature range of -40°C to +105°C, meet AEC [4] -Q100 Grade2 requirements and offer enhanced reliability capabilities that increasingly complex automotive applications require.
The sequential read and write performance of the Automotive UFS Ver. 3.1 device is improved by approximately 2.2x and 6x respectively, over previous gen devices [5]. These performance gains contribute to faster system startup and OTA (Over-the-Air) updates.
[1] Sample shipments of the 256, 128 and 64GB devices will start from March 30, with the 512GB device to follow in April.
[2] Universal Flash Storage (UFS) is a product category for a class of embedded memory products built to the JEDEC UFS standard spec. Due to its serial interface, UFS supports full duplexing, which enables both concurrent reading and writing between the host processor and UFS device.
[3] Advanced Driving Assistant System
[4] Electrical component qualification requirements defined by the AEC (Automotive Electronics Council).
[5] Kioxia Corporation’s previous gen 512GB device THGAFBT2T83BABI
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