Toshiba Memory: Sampling Automotive JEDEC UFS V. 2.1 Embedded Memory Solutions With BiCS Flash 3D Memory

Toshiba Memory Corporation announced that it has begun sampling ^[1] Automotive JEDEC UFS ^[2] Version 2.1 embedded memory solutions utilizing 3D flash memory.

These products are embedded flash memory devices that integrate the company’s BiCS FLASH 3D flash memory and a controller in a single package. The sequential read and write performance are improved by approximately 6% and 33%, respectively, over existing devices ^[3].

The company’s Automotive UFS supports a wide temperature range (-40°C to +105°C), meets AEC-Q100 Grade2 ^[4] requirements and offers the enhanced reliability required by various automotive applications. The lineup consists of four capacities: 32, 64, 128, and 256GB ^[5].

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These UFS devices feature several functions well-suited to the requirements of automotive applications, including Refresh, Thermal Control and Extended Diagnosis. The Refresh function can be used to refresh data stored in UFS, and helps to extend the data’s lifespan. The Thermal Control function protects the device from overheating in the high-temperature circumstances that can occur in automotive applications. Lastly, the Extended Diagnosis function helps users understand the device’s status.

Technology advances in automotive information and entertainment systems and ADAS ^[6] related products for the realization of connected cars and autonomous vehicles will continue to push the storage demands in automotive applications ever higher. As these demands continue to grow, the company will retain a leadership position in the market by reinforcing its lineup of performance, high-capacity memory solutions targeting the sector.

^[1] Specification of the samples may differ from that of commercial products.
^[2] Universal Flash Storage (UFS) is a product category for a class of embedded memory products built to the JEDEC UFS standard specification.
^[3] Comparison between Toshiba Memory Corporation’s 256GB product THGAFBT1T83BAB5 and the existing 128GB product THGAF9T0L8LBAB8. Toshiba Memory survey.
^[4] Electrical component qualification requirements defined by the AEC (Automotive Electronics Council).
^[5] Product density is identified based on the density of memory chip(s) within the product, not the amount of memory capacity available for storage by the end user. Consumer-usable capacity will be less due to overhead data areas, formatting, bad blocks, and other constraints, and may also vary based on the host device and application.
^[6] Advanced Driving Assistant System