Embedded World: ATP Showcases SSDs

As data-driven technologies like machine learning and AI continue to make headway into numerous applications, systems are increasingly becoming capable of sensing, perceiving and analyzing their environments and making judgments and decisions independently.

Era of embedded intelligence
ATP Electronics, Inc. showcases its offerings to empower embedded intelligence at Embedded World 2019, Nuremberg Exhibition Center, Germany on February 26-28, 2019.

“From homes and cities to wearables, transportation, automotive, machinery and more, the embedded world is evolving like never before. Systems are transforming our everyday lives and business operations as they become more perceptive and autonomous,” said Marco Mezger, VP, global marketing, ATP. “As the era of embedded intelligence unfolds, ATP Electronics is privileged to be a major driving force of amazing and exciting innovations, meeting the growing memory and storage needs with our diverse range of industrial only solutions.“

Embedded storage: Empowering embedded intelligence
Whether they are detecting equipment defects, enhancing production processes or monitoring assets, intelligent systems need a lot of dependable storage that could last many years. The company’s embedded solutions offer the sustained performance required by embedded systems operating non-stop in challenging environments. The embedded solutions last long and perform reliably to maximize investment. They are built to endure wide temperatures (-40°C to 85°C) and resist environmental hazards such as shock/vibration, water/humidity, dust and more. Spearheading the embedded range is the I-Temp M.2 NVMe solid state module, which is one of the first to attain industrial temperature rating, operating reliably even in extreme cold or hot environments. It features the firm’s Dynamic Thermal Throttling, which intelligently adjusts performance to cool the system and smartly reduce heat without dramatic declines in performance.

The company’s latest embedded offering, the e.MMC, is a soldered-down storage device compliant with JEDEC e.MMC v5.1 Standard (JESD84-B51). Geared for automotive applications such as in-vehicle infotainment, navigation and event data recording, the eMMC complies with automotive-specific standards such as AEC-Q100 Grade 3, Advanced Product Quality Planning (APQP) and Production Part Approval Process (PPAP). It is smaller than a typical postage stamp but packs 128GB of 3D NAND flash in a 153-ball fine pitch ball grid array (FBGA) package. It features a special SRAM Soft Error Detection Mechanism to ensure data integrity at all times.

Completing company’s embedded range are M.2 2242/2260/2280 SATA modules, mSATA, SlimSATA, 2.5″ SSDs, eUSB, and industrial USB drives. They are lean but tough and durable, making them for compact and mission-critical industrial systems.

Memory cards: A1 agility, high-speed transfers and portable expandability

The company’s portable and removable storage for embedded systems provide fast data transfer, reliable backup and convenient storage expansion. Performance SD/microSD cards with fast random read-write performance (SDA A1 Application Performance Class) feature higher IO/s to run high-speed industrial and automotive applications, deliver agility, 93% lower write latency, 3X higher random R/W performance with 1,500/500 IO/s, 53% lower power consumption and robust durability to withstand environmental and power challenges.

Built using 3D MLC NAND flash, the firm’s A1 performance class industrial and automotive grade memory cards guarantee reliability, endurance, data integrity and responsiveness to meet the challenges of IoT and industrial IoT applications such as edge storage and computing, surveillance/video recording, networking gateways/switches, IoT, automation, AI, mobile computing and health care. They also meet the demands of automotive and Internet of Vehicles (IoV) applications such as in-vehicle infotainment (IVI), event data recording and Advanced Driver Assistance Systems (ADAS).

The company’s memory cards also include CFast in SATA III interface as well as CompactFlash in PATA/IDE. Small and light yet rugged and durable, these storage heavyweights are big in capacity and performance, are built to operate reliably in harsh temperatures, and can withstand vibration/shock, humidity, sudden power loss and other challenges.

DRAM: Accelerated intelligence spanning multiple generations

As machines learn to operate with little to no human intervention and create patterns for decision making like a human brain, they also require processing of high volumes of data, thus boosting demand for fast, performance memory.

The firm’s DRAM modules enable embedded intelligence by meeting the growing need for accelerated performance in memory-intensive computing applications such as telecommunication infrastructure, networking storage systems, industrial PCs and more. Cognizant of infrastructure challenges where legacy systems continue to co-exist with the latest platforms, the company offers a multi-generational solution for industrial memory need.

The firm’s DDR4 modules built for the latest Xeon Scalable and 8th-Generation Intel Corp.‘s Core processors deliver high density and performance. To ensure obsolescence mitigation, the company is slated to provide its own DDR3 8Gb components for its modules. By covering the manufacturing process from IC to module level, the firm reaffirms its commitment to long-term DDR3 supply.

The company is also collaborating with Micron Technology, Inc. under special partnership agreements to produce SDR/DDR/DDR2 memory modules after Micron has announced end-of-life (EOL) notices for these modules.