Electronica: ATP Electronics to Showcase Industrial Memory and Storage Solutions

From autonomous cars to smart cities and factories, everything is getting connected to one another in the intricate mesh of technologies aptly called ‘The Internet of Everything.’ ATP Electronics, Inc. presents its solutions for this data-driven era at Electronica 2018 to be held on November 13 to 16 in Munich, Germany.

“Electronica is one of the biggest electronics trade fairs in the world and ATP Electronics is privileged to participate in this biennial convergence of technology leaders,” said Marco Mezger, VP, global marketing, ATP. “As billions of devices connect to one another, data plays a crucial part in creating a smarter, safer and more secure future. ATP is proud to be in the center of this very interesting phenomenon and taking this year’s theme, Connecting everything – smart, safe and secure’ as an inspiration to create possibilities and take advantage of the myriad of opportunities to store and make sensible use of data from all these interconnections.“

Variety, velocity and volume
Like big data, the company’s industrial/embedded memory and storage solutions are characterized by variety, velocity and volume.

The requirements of industrial/embedded applications are as diverse as their usage cases. The firm’s solutions are available in a variety of form factors, capacities and performance specifications to address different space, operation and deployment requirements.

mSATA SSD

The company’s embedded portfolio includes M.2 2280 NVMe SSDs supporting the NVMe protocol on a PCIe 3.0 x4 interface while 2.5″ SSDs, M.2 2242, 2260 and 2280, mSATA and SlimSATA modules feature the 6Gb SATA interface. A recent addition is the firm’s industrial e.MMC, which is a soldered-down storage device that adheres to JEDEC e.MMC v5.1 Standard (JESD84-B51). Removable storage solutions include performance memory cards with fast random read-write performance (SDA A1 Application Performance Class) for industrial and automotive applications.

Recognizing that storage capacity needs are dependent on workload and usage, the company continues to offer solutions based on 2D (planar) NAND while adopting 3D NAND technology to cater to applications with high-density requirements.

DRAM modules span different generations from DDR1 to the latest DDR4-2666 and are available as RDIMM, UDIMM, SO-DIMM and Mini-RDIMM with ECC/non-ECC, very low or ultra-low profile, and low voltage options. Under a partnership agreement with Micron Technology, Inc., the company also continues to support the memory requirements of legacy systems by manufacturing legacy SDR/DDR/DDR2 memory modules.

Rugged reliability
The firm’s memory and storage solutions for the ‘Internet of Everything’ are built to withstand rigorous operation. Typically installed in compact systems and operating in harsh and remote locations, they can withstand numerous environmental challenges such as sudden power loss, dust, shock, vibration, humidity, electrostatic discharge (ESD) and more. Industrial temperature-rated the company’s products can operate reliably within a wide operating temperature range of -40°C to 85°C.

As a manufacturer, the firm makes sure that all products are thoroughly tested and validated from the IC level up to module/drive level at mass production stage and are certified according to industry standards to ensure long years of dependable use.