Toshiba e•MMC NAND Flash Memory for Automotive Applications

Toshiba Corporation‘s Semiconductor and Storage Products Company announced the launch of 15nm e•MMC ^[1] NAND flash memories for automotive applications.

Company’s automotive e•MMC features an operating temperature range of -40°C to 85°C, the smallest class chip size available for automotive ^[2], an 11.5x13mm JEDEC standard package, and high reliability. Sample shipments start from today.

This line-up of single-package embedded NAND flash memories is suited to the demanding requirements of the automotive infotainment market, and includes densities from 8GB^[3] to 64GB. Each device integrates a controller to manage basic control functions for NAND applications.

According to industry analyst firm Gartner, the majority of vehicles will be connected to the Internet in just five years, with 60% to 75% of them being capable of consuming, creating and sharing Web-based data ^[4]. From maps and weather conditions to voice recognition, entertainment, driver assist features and more – cars are quickly becoming much more than just modes of transportation. Accelerated processing power and increased storage capacity are crucial to enabling all of this connectivity, and firm’s e•MMC NAND flash memory has emerged as the storage technology of choice for automotive applications.

Company’s 15nm chips used for e•MMC are among the world’s smallest. Compliant with the latest JEDEC e•MMC standard, the chips are designed for application in a range of digital products, including automotive infotainment and industrial applications. Firm’s 15nm e•MMC offers fast R/W performance due to improvements in basic chip performance and controller optimization.

Key features include:

• Extended temperature range: -40°C to 85°C

• Low failure rate to support higher quality demands for automotive applications

• Meets AEC-Q100 specifications

• Adheres to PPAP requirements

• Extended support

Outline of products:

^[1] e•MMC is a product category for a class of embedded memory products built to the JEDEC e•MMC Standard specification and is a trademark of the JEDEC Solid State Technology Association.
^[2] As of January 6, 2016. Toshiba survey.
^[3] Product density is identified based on the density of memory chip(s) within the Product, not the amount of memory capacity available for storage by the end user. Consumer-usable capacity will be less due to overhead data areas, formatting, bad blocks, and other constraints, and may also vary based on the host device and application. For details, please refer to applicable product specifications.
^[4] From Gartner report: ‘Predicts 2015: Internet of Things‘

^(*) Maximum read and write speed may vary depending on the host device, read and write conditions, and file size.
^(*) For purposes of measuring read and write speed in this context, one megabyte or MB = 1,000,000 bytes.