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Storadera Opens a New Region

Accelerating Europe presence with Germany being the 4th site | by Philippe Nicolas

DuploCloud Enters Strategic Collaboration Agreement with AWS to bring in Agentic AI to DevOps and IT

The collaboration enables secure, compliant DevOps workflows powered by AI agents leveraging Amazon Bedrock’s LLMs

Availability of Arasan Total IP for Embedded USB2 (eUSB2) with Controller and PHY

eUSB is pervasive in all electronic segments including automotive, enterprise, medical and industrial applications.

Silicon Power Introduces Hypera Up to 1TB microSDXC Express Card Compatible Nintendo Switch 2

Up to 880MB/s and up to 700MB/s RW speeds, and with PCIe Gen 3x1 and NVMe technology
ExaGrid

Teledyne LeCroy Launches Gen T Exerciser to Accelerate USB4 Gen T Compliance and Performance Testing

Adds Gen T analysis and compliance support to Voyager protocol test solutions

ionstream Expands Bare-Metal Cloud With NVIDIA B200 For Extreme GPU Inferencing and Training Performance

Addressing cloud GPU shortages and pricing inefficiencies, ionstream’s new platform offers a reliable, enterprise-grade alternative to hyperscalers

More Control and Less Complexity with Tiger Bridge 5.2

New interface and smarter automation, for a better control, faster workflows, and a more intuitive experience | by Philippe Nicolas

Preservica and Gravity Union Partner

To streamline long-term data archiving and governance in Microsoft 365 for Canadian organizations
AIC

R&D: Thermal Conductance Analysis of [FePt/h-BN/FePt] Interface

Work can advance understanding of thermal transport across the 2D-material/metal contacts and provide valuable insights for design of HAMR media with thermally isolated FePt grains.

R&D: Reversible Memory Operation of Al/TeO2-ZnO-Au/ TeO2-ZnO/p-Si MIS Structures

Memory device emerges as a promising candidate to address the escalating demand for enhanced data storage density and versatility in modern semiconductor memory technologies.

CEA Assigned Patent

Managing cache memory
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