Spansion Sampling SLC NAND Flash Chip Family
This is a Press Release edited by StorageNewsletter.com on Mon, May 28th, 2012
And unveils roadmap through 2017
SLC NAND will be offered in densities from 1Gb to 8Gb in 3.0V and 1.8V families that feature performance, extended temperature range, long-term product support and reliability demands, such as 1-bit ECC. Additionally, Spansion also unveiled its SLC NAND product roadmap through 2017.
SLC NAND products complement the company's parallel and serial NOR flash memory portfolio. When designs require performance code execution and storage to create rich user experiences, designers can select Spansion parallel or serial NOR flash memory.
Storage needs can be addressed with new SLC NAND flash solutions that deliver the reliability and product longevity. With Spansion's broad NOR and NAND flash memory portfolio, embedded customers have access to a range of non-volatile memory products, all backed by Spansion's customer support and service.
Spansion's five-year technology roadmap includes 1Gb - 8Gb SLC NAND solutions on 4xnm technology today, 3xnm technology by end of 2012 and 2xnm in 2014.
"Spansion is a strategic partner of Coship, with a strong track record of providing NOR flash memory that meets our high standards for quality, reliability, performance and support," said Ruiliang Yang, VP, PhD, Coship Electronics Co.,Ltd. "Its expertise in serving the needs of the embedded industry makes Spansion a welcome addition to the SLC NAND flash market."
"Spansion fills a void in the NAND market with its new SLC NAND flash memory," said Russell Crane, product marketing manager, Sitara ARM processors, Texas Instruments, Inc. "Spansion understands the needs of the embedded segment, particularly the requirements for long-term product support and reliability. We are excited to broaden our collaboration beyond parallel and serial flash memory to include Spansion SLC NAND."
"The introduction of Spansion SLC NAND products is a very positive development for the embedded market," said Michael Yang, senior principal analyst for Memory and Storage, IHS iSuppli. "SLC NAND has solid growth potential in embedded, led by the automotive and consumer segments. This is especially true for embedded applications requiring product longevity as we head down the path toward smarter connected homes and automobiles."
"Apps are moving beyond the smartphone and into set-top boxes, digital TVs and even the car. This new functionality is increasing the complexity of embedded systems and expanding application storage needs," said Bob France, VP product marketing at Spansion. "The new Spansion SLC NAND flash memory is perfectly suited for these market trends. It features the right balance of performance, reliability, density range and long-term support that embedded designers require."
Key Facts of the Spansion SLC NAND family:
- 3.0 Volt 1Gb, 2Gb and 4Gb monolithic solutions are sampling now
- 1.8 Volt 1Gb, 2Gb and 4Gb monolithic solutions will begin sampling at the end of 2012
- 8 Gb solutions will sample in the second half of 2012
- 4xnm floating-gate process technology
- Industrial temperature range (-40C to +85C)
- Reliability with 100,000 cycle endurance with recommended 1-bit ECC
- SLC NAND performance with 25μs random access, 25ns sequential access, and up to 200μs programming
- Industry-standard 48-pin TSOP package via Spansion's Universal Footprint
- Industry-standard NAND signal interface and command set
- Complimentary Spansion FFS - customized software drivers and flash file system software
- Long-term product support
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