StorageNewsletter

Today's Top News

FMS 2026: Exclusive Interview with KS Pua, CEO and Cofounder, Phison Electronics

[comments] During FMS 2026 following spectacular financial results

Also today

FMS 2026: Samsung Unveils Next-Gen 3D-Memory Vision, Charting the Future of AI Infrastructure

Confirming its role in the industry

FMS 2026: New 3D Flash Memory Technology from Kioxia and Sandisk Achieves Industry’s Highest Bit Density for QLC NAND

10th-generation QLC 3D flash memory represents a major leap forward for AI storage architectures, cloud platforms, and data intensive innovations

FMS 2026: Sandisk and SK hynix Advance Global Standardization of High Bandwidth Flash with Release of First OCP Technical Specification

Open Compute Project specification provides foundation for high bandwidth flash adoption in AI inference systems

FMS 2026: NEO Semiconductor Launches NEO.AI Memory Platform to Solve AI’s Two Biggest Memory Bottlenecks

X-SRAM delivers up to 5× higher on-chip memory density, while 3D X-DRAM enables up to 10× higher HBM capacity – breaking the AI memory wall by overcoming SRAM and DRAM scaling limits

FMS 2026: Sandisk Showcases NAND Innovation for the Era of AI Inference

With HBF, enterprise SSD and BiCS10 QLC flash

FMS 2026: Kioxia Announces Kioxia GP1 Series Super High IOPS SSDs for AI Applications

PCIe 6.0 SSD achieves 10 million IOPS using Kioxia XL-FLASH flash memory

FMS 2026: Marvell Advances AI Memory Infrastructure Portfolio to Accelerate Agentic AI Inference

As agentic AI inference scales, memory capacity, bandwidth and connectivity are becoming as critical as compute

FMS 2026: Microchip Technology, in Collaboration with Micron Technology, Demonstrates High-Performance PCIe Gen 6 Storage Architecture for AI and Data Center Infrastructure

Switchtec PCIe Switches and Micron 9650 NVMe SSDs leverage next generation interface technology to deliver increased bandwidth, low latency, and scalable storage connectivity