Kioxia CM9 Series supports cold-plate cooling option in E3.S form factor for AI and other high-performance environments
To tackle aggressive memory demand
New 102.4Tbps, 1.5OU fully liquid-cooled system is designed to increase bandwidth density and reduce power in OCP ORv3 deployments
With technology applications
Delivering a unified infrastructure blueprint for scalable AI across compute, networking, memory and storage
Micas' Tomahawk 6-based portfolio spans 800G air-cooled, 1.6T liquid-cooled, and 1.6T Davisson CPO systems for next-generation AI factories
Micro-emitter-based, pluggable solution targets scale-out and front-end connectivity up to 50m with copper-class reliability at lower power and reduced cable bulk
Next-generation 24kW power delivery board converts 800 VDC directly to 12 VDC in a single stage, eliminating the 50V IBC power stage, boosting system efficiency and reducing board space
Putting enterprise data to work for AI
| by Philippe Nicolas
An "infrastructure operating system" to replace VMware
| by Philippe Nicolas