Ultra dense memory: atom scale material dynamics and systems consequence, and BIA: Co-design methodology to transform materials and computer architecture research for energy efficiency
Featuring Xeon 6900 series processors with P-cores, including X14 SuperBlade, X14 FlexTwin, and X14 Hyper, and GPU-optimized, PCIe GPU , Intel Gaudi 3 AI Accelerators platforms
Up to 1.8PB (effective capacity) in 4U rack space, up to 310GB/S throughput with low latency, and up to 13 millions IOs using NVMeoF
Facilitates large-scale, cross-site NAS backup/restore jobs of Hybrid Backup Sync from single central web-based portal, join beta program
With incident response provider partnerships, fortifying cyber resilience
Slim profile/single-sided design that reduces height by 1.35mm compared to dual-sided models and operating reliably between -40°C and 85°C
Up to 13,500MB/s and 11,000MB/s RW speeds, and paired with T-Force AirFlow SSD Cooler with advanced active cooling technology
Engineered for HPC and AI applications,and ensure stability and security even in extreme industrial environments
New facility to open by mid-2025 to fuel innovation and ongoing effort to recruit from India's top universities
Explore ways to alleviate impact of in-plane grains by optimizing media parameters and identifying sensitivity for each media parameter
Evaluate effects of modified Ea model and classic Arrhenius model with epitaxial data and conclude that former can reduce the error by approximately 70% to maximum.
Computer readable media for software defined storage security protection
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