StorageNewsletter

The Engines of American-Made Intelligence: Nvidia and TSMC Celebrate First Nvidia Blackwell Wafer Produced in the US

[comments] The celebration showcased how manufacturing the world's AI technology stack in America will fuel innovation and bolster the US supply chain

Also today

CoreWeave to Acquire Monolith, Expanding AI Cloud Platform into Industrial Innovation

To power the next generation of industrial innovation through AI and machine learning

DCAI Expands AI Infrastructure Offering with Weka’s Integrated Storage Services

DCAI delivers hyperscaler-grade performance across storage and compute, complementing denmark's Gefion HPC with Weka's NeuralMesh technology

Enabling High-Performance Data Movement for Europe’s Exascale Supercomputer, JUPITER

Leveraging data management expertise and development already proven at scale | by Philippe Nicolas

TerraMaster Launches 3+4-Bay F4-425 Plus and 3+2-Bay F2-425 Plus Desktop NAS

Including Intel N150 processors with dual 5GbE, AI privacy protection, and up to 144TB expandable storage

Longsys Unveils Integrated-packaging mSSD or Micro SSD

Integrates the controller, NAND Flash, and PMIC within single SiP package, PCIe Gen4×4 standards, and supports TLC/QLC NAND and capacities from 512GB to 4TB

Embedded World North America 2025: Cervoz to Showcase Edge Storage, Memory, and Expansion Cards

Including Edge AI SSDs, MIL-STD-810H certified DDR4/DDR5 DRAM, M.2, and 2.5" SSDs, DRAM module portfolio, connectivity lineup covers Mini PCIe, M.2, and PCIe expansion cards

OpenDrives and Versatile Distribution Services Announce Collaboration to Accelerate Channel Growth

New distribution agreement brings turnkey OpenDrives solutions to market faster, simplifying access for resellers and users

Other World Computing to Present “Right-to-Repair in Practice: Design, Parts, and Policy Across the Electronics Lifecycle” at E-Scrap Conference

Covering tensions, opportunities, and collaborations needed to align product design with long-term reuse, refurbishment, and recycling goals

DMTF Celebrates 10 Years of Redfish – Marking Decade of Innovation in Modern IT Management

Redfish has continuously evolved to meet changing demands of data centers, edge computing, and composable infrastructure.

JEDEC Upcoming Standard JESD328 SOCAMM2 for Low-profile LPDRAM Modules

Low power compact LPDDR5X modules poised to power next-gen AI Servers

GSI Technology Compute-In-Memory APU Achieves GPU-Class AI Performance at Fraction of Energy Cost

APU CIM architectures can match GPU-level performance for large-scale AI applications with reduction in energy consumption due to high-density and high-bandwidth memory associated with CIM architecture.