StorageNewsletter

Today's Top News

HPE: Fiscal 1Q25 Financial Results

Revenue at $7.9 billion, up 16% from the prior-year period, fourth consecutive quarter of Y/Y revenue growth

Also today

Everspin Awarded $10.5M Contract

To provide MRAM IP and foundry services for Purdue University's ME Commons In-Memory Compute Project

Stack Capital Group Invests $10 Million Into CoreWeave

A global AI infrastructure company that recently filed its IPO

Two New Members of Board of Directors at Micron

Mark Liu, former TSMC chairman and Christie Simons former Deloitte & Touche Partner

Jonathan Morgan Left DataCore

Following the very surprising acquisition of Arcastream | by Philippe Nicolas

Leaseweb Senior Leadership Transition

Svenja de Vos and Lex Boost appointed Co-CEOs with Con Zwinkels and Pieter Dijkhuis moving to supervisory roles

New Channel Toshiba Distributor for HDDs in Indonesia Region

PT. Astrindo Starvision in Indonesia, through collaboration with Dynabook Singapore

Recap of 60th IT Press Tour in Silicon Valley, CA

With 9 companies: Aquila Clouds, CloudFabrix, Crystal DB, Hammerspace, iXsystems, Komprise, MLCommons, Panzura and Volumez | by Philippe Nicolas

QNAP Updated QuTScloud c5.2 Cloud NAS OS Strengthened Security with Security Center and Enhanced Management Features

Subscription-based pricing model starting at $5/month, update introduces Security Center proactive security application that monitors Cloud NAS file activities and defends against ransomware threats.

Embedded World 2025: Tuxera Shares Strategies to Manage, Secure, and Access Mission-critical Data

Showcasing Reliance Nitro, Reliance Edge, FlashFX Tera, Tuxera Networking Suite, and Crypto Core solutions

Embedded World 2025: Silicon Motion Showcasing Storage Solutions for AI and Display Interface SoCs

Including SM2264XT-AT PCIe Gen4 automotive-grade SSD controller, Ferri embedded storage solutions, SM770 display interface SoC, and MonTitan 128TB QLC SSD powered by SM8366

Embedded World 2025: Longsys Showcasing Industrial Storage and Memory

Including industrial DDR5 DIMM, high-capacity SATA SSDs, PCIe Gen4 SSDs, embedded storage, SD/microSD cards, and automotive USB drives

Embedded World 2025: TeamGroup To Showcase Industrial-Grade Storage and Memory Solutions

Including D500R WORM memory card, P250Q One-Click Data Destruction SSD, R840 and R250 PCIe Gen5x4 industrial SSDs, CU-DIMM and CSO-DIMM memory modules, CAMM2 and LPCAMM2 memory modules, and CXL 2.0 Server memory module

Embedded world 2025: EMASS and Weebit Nano Collaboration on Ultra-low-power Edge AI Demonstration using ReRAM

ReRAM technology with ultra-low power AI SoC at 22nm process node aims to enhance energy efficiency, reduce power consumption, and enable instant system wake-up for AI-driven applications, unlocking new capabilities in edge computing

Embedded World 2025: AEWIN Showcases High-Density Edge Computing 2U Server

With single AMD EPYC 9005/9004 processor, 8xPCIe Gen5 slots (2xdual width FHFL PCIe x16 or 4xsingle width FHFL x16, 2xsingle width FHHL PCIe x16, 2xHHHL PCIe x8) + 1xOCP 3.0 slot for NICs and accelerators

QNAP Security Enhancement with Ten Security Advisories on Resolved Vulnerabilities

Concerning QVPN Device Client, Qsync Client, and Qfinder Pro for Mac, QTS and QuTS hero, QuLog Center, Legacy QTS, and Legacy QuTS hero, File Station 5, QuRouter, Helpdesk, and HBS 3 Hybrid Backup Sync

R&D: Model of Advanced Recording system for Application in HAMR

Study the effect of crucial factors such as laser current, frequency of the writing field and grain size distribution of recording media on the WCAP.

R&D: Modeling Methodology for Thermo-Structural Analysis of V-NAND Flash Memory Structure

Study proposes modeling methodology based on continuous model for conducting thermo-electric-structural analyses of V-NAND flash memory structure under Joule heating effect.

Sunrise Memory Assigned Five Patents

Quasi-volatile memory with reference bit line structure, 3D vertical Nor flash thin-film transistor strings, memory controller including write staging buffer to manage write requests for high capacity memory circuit with large number of independently accessible memory banks, 3D memory structure fabrication using channel replacement, memory device including reference bit line for increasing read operation accuracy